MPC875CVR133

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Operating Temperature :

-40°C~100°C TA

Terminal Position :

BOTTOM

Peak Reflow Temperature (Cel) :

245

Graphics Acceleration :

No

Published :

1999

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Packaging :

Tray

Address Bus Width :

32

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

ECCN Code :

5A002.A.1

RAM Controllers :

DRAM

Height Seated (Max) :

2.54mm

Format :

FIXED POINT

Base Part Number :

MPC875

Terminal Pitch :

1.27mm

Time@Peak Reflow Temperature-Max (s) :

30

Ethernet :

10Mbps (1), 10/100Mbps (2)

Number of Cores/Bus Width :

1 Core 32-Bit

Co-Processors/DSP :

Communications; CPM, Security; SEC

Series :

MPC8xx

Boundary Scan :

yes

Integrated Cache :

yes

Number of Terminations :

256

Factory Lead Time :

12 Weeks

Voltage - I/O :

3.3V

Supply Voltage-Min (Vsup) :

1.7V

RoHS Status :

ROHS3 Compliant

Terminal Form :

Ball

External Data Bus Width :

32

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Bit Size :

32

USB :

USB 2.0 (1)

Low Power Mode :

yes

Surface Mount :

yes

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Package / Case :

256-BBGA

Security Features :

Cryptography

Supply Voltage-Max (Vsup) :

1.9V

Length :

23mm

JESD-30 Code :

S-PBGA-B256

Speed :

133MHz

Power Supplies :

1.83.3V

HTS Code :

8542.31.00.01

JESD-609 Code :

e1

Supply Voltage :

1.8V