MPC860TZQ50D4R2

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Speed :

50MHz

Height Seated (Max) :

2.52mm

Supply Voltage-Max (Vsup) :

3.465V

JESD-30 Code :

S-PBGA-B357

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

RAM Controllers :

DRAM

Graphics Acceleration :

No

Boundary Scan :

yes

ECCN Code :

3A991.A.2

Factory Lead Time :

12 Weeks

Terminal Position :

BOTTOM

Operating Temperature :

0°C~95°C TA

RoHS Status :

Non-RoHS Compliant

Address Bus Width :

32

HTS Code :

8542.31.00.01

Terminal Form :

Ball

JESD-609 Code :

e0

Clock Frequency :

50MHz

Base Part Number :

MPC860

Time@Peak Reflow Temperature-Max (s) :

30

Surface Mount :

yes

Number of Terminations :

357

Published :

1995

Format :

FIXED POINT

Package / Case :

357-BBGA

Bit Size :

32

Integrated Cache :

yes

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Series :

MPC8xx

Low Power Mode :

yes

Supply Voltage-Min (Vsup) :

3.135V

Terminal Pitch :

1.27mm

Terminal Finish :

Tin/Lead (Sn/Pb)

Length :

25mm

Packaging :

Tape and Reel (TR)

Number of Cores/Bus Width :

1 Core 32-Bit

Power Supplies :

3.3V

Voltage - I/O :

3.3V

Co-Processors/DSP :

Communications; CPM

Peak Reflow Temperature (Cel) :

245

Supply Voltage :

3.3V

External Data Bus Width :

32

Ethernet :

10Mbps (4), 10/100Mbps (1)