MPC860TZQ50D4

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Base Part Number :

MPC860

JESD-30 Code :

S-PBGA-B357

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Factory Lead Time :

12 Weeks

Published :

1995

Number of Cores/Bus Width :

1 Core 32-Bit

Clock Frequency :

50MHz

Ethernet :

10Mbps (4), 10/100Mbps (1)

External Data Bus Width :

32

HTS Code :

8542.31.00.01

Terminal Position :

BOTTOM

Graphics Acceleration :

No

Format :

FIXED POINT

RoHS Status :

Non-RoHS Compliant

Packaging :

Tape and Reel (TR)

RAM Controllers :

DRAM

Surface Mount :

yes

Terminal Pitch :

1.27mm

ECCN Code :

3A991.A.2

Address Bus Width :

32

Operating Temperature :

0°C~95°C TA

Number of Terminations :

357

Terminal Form :

Ball

Height Seated (Max) :

2.52mm

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Length :

25mm

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Boundary Scan :

yes

Supply Voltage :

3.3V

Bit Size :

32

Power Supplies :

3.3V

Co-Processors/DSP :

Communications; CPM

Integrated Cache :

yes

Voltage - I/O :

3.3V

Low Power Mode :

yes

Package / Case :

357-BBGA

Peak Reflow Temperature (Cel) :

245

Terminal Finish :

Tin/Lead (Sn/Pb)

Time@Peak Reflow Temperature-Max (s) :

30

Supply Voltage-Min (Vsup) :

3.135V

Supply Voltage-Max (Vsup) :

3.465V

Speed :

50MHz

JESD-609 Code :

e0

Series :

MPC8xx