MPC860TVR50D4

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

JESD-609 Code :

e1

Series :

MPC8xx

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Number of Terminations :

357

ECCN Code :

3A991.A.2

Supply Voltage-Max (Vsup) :

3.465V

Terminal Pitch :

1.27mm

External Data Bus Width :

32

Speed :

50MHz

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Format :

FIXED POINT

RAM Controllers :

DRAM

Factory Lead Time :

8 Weeks

Packaging :

Tray

JESD-30 Code :

S-PBGA-B357

Clock Frequency :

50MHz

RoHS Status :

ROHS3 Compliant

Low Power Mode :

yes

Graphics Acceleration :

No

Base Part Number :

MPC860

Package / Case :

357-BBGA

HTS Code :

8542.31.00.01

Integrated Cache :

yes

Ethernet :

10Mbps (4), 10/100Mbps (1)

Power Supplies :

3.3V

Boundary Scan :

yes

Terminal Form :

Ball

Supply Voltage :

3.3V

Length :

25mm

Height Seated (Max) :

2.52mm

Supply Voltage-Min (Vsup) :

3.135V

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Surface Mount :

yes

Published :

2004

Voltage - I/O :

3.3V

Time@Peak Reflow Temperature-Max (s) :

30

Address Bus Width :

32

Co-Processors/DSP :

Communications; CPM

Terminal Position :

BOTTOM

Bit Size :

32

Number of Cores/Bus Width :

1 Core 32-Bit

Operating Temperature :

0°C~95°C TA

Peak Reflow Temperature (Cel) :

245