MPC860TCZQ66D4

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Terminal Position :

BOTTOM

Supply Voltage-Max (Vsup) :

3.465V

Voltage - I/O :

3.3V

Operating Temperature :

-40°C~95°C TA

Surface Mount :

yes

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Terminal Finish :

Tin/Lead (Sn/Pb)

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

JESD-609 Code :

e0

Peak Reflow Temperature (Cel) :

245

Integrated Cache :

yes

Number of Cores/Bus Width :

1 Core 32-Bit

Format :

FIXED POINT

RoHS Status :

Non-RoHS Compliant

Boundary Scan :

yes

Packaging :

Tray

Graphics Acceleration :

No

Base Part Number :

MPC860

Series :

MPC8xx

Ethernet :

10Mbps (4), 10/100Mbps (1)

Bit Size :

32

Supply Voltage-Min (Vsup) :

3.135V

ECCN Code :

3A991.A.2

JESD-30 Code :

S-PBGA-B357

Speed :

66MHz

Height Seated (Max) :

2.52mm

Factory Lead Time :

12 Weeks

Package / Case :

357-BBGA

Clock Frequency :

50MHz

RAM Controllers :

DRAM

Terminal Pitch :

1.27mm

Published :

1995

HTS Code :

8542.31.00.01

Time@Peak Reflow Temperature-Max (s) :

30

Supply Voltage :

3.3V

External Data Bus Width :

32

Number of Terminations :

357

Terminal Form :

Ball

Power Supplies :

3.3V

Low Power Mode :

yes

Address Bus Width :

32

Co-Processors/DSP :

Communications; CPM

Length :

25mm

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART