MPC860TCZQ66D4

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Series :

MPC8xx

External Data Bus Width :

32

Peak Reflow Temperature (Cel) :

245

Terminal Pitch :

1.27mm

HTS Code :

8542.31.00.01

Operating Temperature :

-40°C~95°C TA

Voltage - I/O :

3.3V

JESD-609 Code :

e0

Terminal Position :

BOTTOM

Packaging :

Tray

Supply Voltage-Min (Vsup) :

3.135V

Power Supplies :

3.3V

Height Seated (Max) :

2.52mm

RAM Controllers :

DRAM

Integrated Cache :

yes

Number of Cores/Bus Width :

1 Core 32-Bit

Number of Terminations :

357

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Package / Case :

357-BBGA

Base Part Number :

MPC860

Length :

25mm

Bit Size :

32

Time@Peak Reflow Temperature-Max (s) :

30

Supply Voltage-Max (Vsup) :

3.465V

Terminal Form :

Ball

Factory Lead Time :

12 Weeks

JESD-30 Code :

S-PBGA-B357

Surface Mount :

yes

Boundary Scan :

yes

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Low Power Mode :

yes

Terminal Finish :

Tin/Lead (Sn/Pb)

Co-Processors/DSP :

Communications; CPM

Format :

FIXED POINT

ECCN Code :

3A991.A.2

Supply Voltage :

3.3V

Published :

1995

RoHS Status :

Non-RoHS Compliant

Graphics Acceleration :

No

Speed :

66MHz

Address Bus Width :

32

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Clock Frequency :

50MHz

Ethernet :

10Mbps (4), 10/100Mbps (1)