MPC860SRZQ50D4

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Package / Case :

357-BBGA

Operating Temperature :

0°C~95°C TA

Address Bus Width :

32

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Base Part Number :

MPC860

JESD-30 Code :

S-PBGA-B357

Format :

FIXED POINT

Integrated Cache :

yes

Terminal Pitch :

1.27mm

Terminal Position :

BOTTOM

Terminal Form :

Ball

Ethernet :

10Mbps (4)

Supply Voltage-Min (Vsup) :

3.135V

Series :

MPC8xx

Time@Peak Reflow Temperature-Max (s) :

30

Supply Voltage :

3.3V

External Data Bus Width :

32

ECCN Code :

3A991.A.2

RoHS Status :

Non-RoHS Compliant

Number of Terminations :

357

Surface Mount :

yes

Clock Frequency :

50MHz

Number of Cores/Bus Width :

1 Core 32-Bit

Packaging :

Tray

RAM Controllers :

DRAM

HTS Code :

8542.31.00.01

Terminal Finish :

Tin/Lead (Sn/Pb)

Supply Voltage-Max (Vsup) :

3.465V

Power Supplies :

3.3V

Graphics Acceleration :

No

Voltage - I/O :

3.3V

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

JESD-609 Code :

e0

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Boundary Scan :

yes

Peak Reflow Temperature (Cel) :

245

Low Power Mode :

yes

Length :

25mm

Bit Size :

32

Published :

1995

Co-Processors/DSP :

Communications; CPM

Speed :

50MHz

Height Seated (Max) :

2.52mm