MPC860ENZQ50D4

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Terminal Pitch :

1.27mm

Clock Frequency :

50MHz

Packaging :

Tray

Qualification Status :

COMMERCIAL

Length :

25mm

Peak Reflow Temperature (Cel) :

245

Address Bus Width :

32

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

RAM Controllers :

DRAM

Additional Interfaces :

I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

Pin Count :

357

Supply Voltage-Max (Vsup) :

3.465V

Number of Terminations :

357

Integrated Cache :

yes

Supply Voltage :

3.3V

Series :

MPC8xx

Pbfree Code :

No

Supply Voltage-Min (Vsup) :

3.135V

Surface Mount :

yes

Ethernet :

10Mbps (4)

Speed :

50MHz

Boundary Scan :

yes

Package / Case :

357-BBGA

Format :

FIXED POINT

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Voltage - I/O :

3.3V

Number of Cores/Bus Width :

1 Core 32-Bit

Graphics Acceleration :

No

Low Power Mode :

yes

Terminal Form :

Ball

RoHS Status :

Non-RoHS Compliant

JESD-609 Code :

e0

Bit Size :

32

Terminal Finish :

TIN LEAD

Terminal Position :

BOTTOM

Height Seated (Max) :

2.52mm

Co-Processors/DSP :

Communications; CPM

Time@Peak Reflow Temperature-Max (s) :

30

External Data Bus Width :

32

JESD-30 Code :

S-PBGA-B357

Operating Temperature :

0°C~95°C TA