MPC860DEZQ66D4

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Number of Terminations :

357

HTS Code :

8542.31.00.01

Boundary Scan :

yes

Graphics Acceleration :

No

Supply Voltage-Max (Vsup) :

3.465V

Series :

MPC8xx

Additional Interfaces :

I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

External Data Bus Width :

32

RAM Controllers :

DRAM

Supply Voltage-Min (Vsup) :

3.135V

Time@Peak Reflow Temperature-Max (s) :

30

Factory Lead Time :

26 Weeks

JESD-30 Code :

S-PBGA-B357

Low Power Mode :

yes

Terminal Pitch :

1.27mm

Published :

1999

Clock Frequency :

50MHz

Power Supplies :

3.3V

Co-Processors/DSP :

Communications; CPM

Surface Mount :

yes

Height Seated (Max) :

2.52mm

Voltage - I/O :

3.3V

Address Bus Width :

32

Number of Cores/Bus Width :

1 Core 32-Bit

Speed :

66MHz

Terminal Form :

Ball

Supply Voltage :

3.3V

ECCN Code :

3A991

Base Part Number :

MPC860

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Terminal Position :

BOTTOM

Packaging :

Tray

Ethernet :

10Mbps (2)

Operating Temperature :

0°C~95°C TA

Length :

25mm

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Bit Size :

32

RoHS Status :

Non-RoHS Compliant

Peak Reflow Temperature (Cel) :

245

JESD-609 Code :

e0

Terminal Finish :

TIN LEAD

Package / Case :

357-BBGA

Integrated Cache :

yes

Format :

FIXED POINT