MPC860DEZQ66D4

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Number of Terminations :

357

Ethernet :

10Mbps (2)

Supply Voltage :

3.3V

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Length :

25mm

JESD-30 Code :

S-PBGA-B357

Format :

FIXED POINT

Graphics Acceleration :

No

Boundary Scan :

yes

RAM Controllers :

DRAM

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Package / Case :

357-BBGA

Additional Interfaces :

I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

Supply Voltage-Min (Vsup) :

3.135V

Terminal Pitch :

1.27mm

Peak Reflow Temperature (Cel) :

245

Terminal Finish :

TIN LEAD

Power Supplies :

3.3V

Operating Temperature :

0°C~95°C TA

Terminal Form :

Ball

Integrated Cache :

yes

Co-Processors/DSP :

Communications; CPM

JESD-609 Code :

e0

Voltage - I/O :

3.3V

Bit Size :

32

RoHS Status :

Non-RoHS Compliant

Base Part Number :

MPC860

ECCN Code :

3A991

Series :

MPC8xx

Height Seated (Max) :

2.52mm

HTS Code :

8542.31.00.01

External Data Bus Width :

32

Supply Voltage-Max (Vsup) :

3.465V

Factory Lead Time :

26 Weeks

Time@Peak Reflow Temperature-Max (s) :

30

Low Power Mode :

yes

Published :

1999

Speed :

66MHz

Number of Cores/Bus Width :

1 Core 32-Bit

Clock Frequency :

50MHz

Packaging :

Tray

Address Bus Width :

32

Terminal Position :

BOTTOM

Surface Mount :

yes