MPC860DEZQ50D4

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Package / Case :

357-BBGA

Supply Voltage-Max (Vsup) :

3.465V

Low Power Mode :

yes

Terminal Pitch :

1.27mm

HTS Code :

8542.31.00.01

External Data Bus Width :

32

Surface Mount :

yes

RAM Controllers :

DRAM

Terminal Finish :

Tin/Lead (Sn/Pb)

Series :

MPC8xx

Number of Cores/Bus Width :

1 Core 32-Bit

Supply Voltage :

3.3V

JESD-609 Code :

e0

Additional Interfaces :

I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

Power Supplies :

3.3V

Clock Frequency :

50MHz

Graphics Acceleration :

No

Height Seated (Max) :

2.52mm

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Operating Temperature :

0°C~95°C TA

Address Bus Width :

32

Co-Processors/DSP :

Communications; CPM

Packaging :

Tray

Length :

25mm

Published :

2004

JESD-30 Code :

S-PBGA-B357

Time@Peak Reflow Temperature-Max (s) :

30

Number of Terminations :

357

Terminal Position :

BOTTOM

Peak Reflow Temperature (Cel) :

245

Supply Voltage-Min (Vsup) :

3.135V

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Integrated Cache :

yes

Ethernet :

10Mbps (2)

ECCN Code :

3A991.A.2

RoHS Status :

Non-RoHS Compliant

Speed :

50MHz

Base Part Number :

MPC860

Boundary Scan :

yes

Format :

FIXED POINT

Terminal Form :

Ball

Bit Size :

32

Voltage - I/O :

3.3V