MPC860DECVR50D4

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Power Supplies :

3.3V

Package / Case :

357-BBGA

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Number of Terminations :

357

Terminal Form :

Ball

Surface Mount :

yes

External Data Bus Width :

32

Address Bus Width :

32

JESD-609 Code :

e1

Time@Peak Reflow Temperature-Max (s) :

30

Terminal Pitch :

1.27mm

HTS Code :

8542.31.00.01

Bit Size :

32

Height Seated (Max) :

2.52mm

Ethernet :

10Mbps (2)

JESD-30 Code :

S-PBGA-B357

Clock Frequency :

50MHz

Additional Interfaces :

I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

Series :

MPC8xx

Length :

25mm

Supply Voltage :

3.3V

Published :

1995

Number of Cores/Bus Width :

1 Core 32-Bit

Operating Temperature :

-40°C~95°C TA

ECCN Code :

3A991.A.2

Boundary Scan :

yes

Packaging :

Tray

Base Part Number :

MPC860

Peak Reflow Temperature (Cel) :

245

Voltage - I/O :

3.3V

Terminal Position :

BOTTOM

RoHS Status :

ROHS3 Compliant

Low Power Mode :

yes

Supply Voltage-Min (Vsup) :

3.135V

Terminal Finish :

TIN SILVER COPPER

Supply Voltage-Max (Vsup) :

3.465V

RAM Controllers :

DRAM

Factory Lead Time :

12 Weeks

Speed :

50MHz

Graphics Acceleration :

No

Format :

FIXED POINT

Integrated Cache :

yes

Co-Processors/DSP :

Communications; CPM

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC