MPC859DSLCZP50A

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Supply Voltage-Min (Vsup) :

1.7V

Number of Cores/Bus Width :

1 Core 32-Bit

Height Seated (Max) :

2.52mm

Package / Case :

357-BBGA

Base Part Number :

MPC859

Terminal Form :

Ball

Supply Voltage :

1.8V

Address Bus Width :

32

Factory Lead Time :

8 Weeks

Co-Processors/DSP :

Communications; CPM

Series :

MPC8xx

Speed :

50MHz

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Surface Mount :

yes

Boundary Scan :

yes

Number of Terminations :

357

Terminal Pitch :

1.27mm

RAM Controllers :

DRAM

External Data Bus Width :

32

Time@Peak Reflow Temperature-Max (s) :

30

Packaging :

Tray

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Supply Voltage-Max (Vsup) :

1.9V

Voltage - I/O :

3.3V

RoHS Status :

Non-RoHS Compliant

Integrated Cache :

yes

Operating Temperature :

-40°C~100°C TA

Bit Size :

32

JESD-609 Code :

e0

Terminal Finish :

Tin/Lead (Sn/Pb)

HTS Code :

8542.31.00.01

Length :

25mm

Power Supplies :

1.83.3V

JESD-30 Code :

S-PBGA-B357

ECCN Code :

3A991.A.2

Format :

FIXED POINT

Low Power Mode :

yes

Additional Interfaces :

I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

Graphics Acceleration :

No

Peak Reflow Temperature (Cel) :

220

Terminal Position :

BOTTOM

Ethernet :

10Mbps (1), 10/100Mbps (1)

Published :

1999