MPC857TZQ66B

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Height Seated (Max) :

2.52mm

ECCN Code :

5A991

Number of Terminations :

357

Time@Peak Reflow Temperature-Max (s) :

30

Package / Case :

357-BBGA

Integrated Cache :

yes

Packaging :

Tray

Base Part Number :

MPC857

Supply Voltage-Min (Vsup) :

3.135V

Terminal Position :

BOTTOM

Series :

MPC8xx

Terminal Finish :

Tin/Lead (Sn/Pb)

Voltage - I/O :

3.3V

Published :

2004

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

JESD-609 Code :

e0

Peak Reflow Temperature (Cel) :

245

Format :

FIXED POINT

Length :

25mm

Co-Processors/DSP :

Communications; CPM

Terminal Form :

Ball

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Operating Temperature :

0°C~105°C TA

Terminal Pitch :

1.27mm

Speed :

66MHz

Surface Mount :

yes

Number of Cores/Bus Width :

1 Core 32-Bit

RAM Controllers :

DRAM

HTS Code :

8542.31.00.01

Ethernet :

10Mbps (1), 10/100Mbps (1)

Bit Size :

32

External Data Bus Width :

32

Low Power Mode :

yes

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Supply Voltage-Max (Vsup) :

3.465V

Boundary Scan :

yes

Address Bus Width :

32

Supply Voltage :

3.3V

Graphics Acceleration :

No

RoHS Status :

Non-RoHS Compliant

JESD-30 Code :

S-PBGA-B357