MPC857TZQ100B

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

HTS Code :

8542.31.00.01

JESD-30 Code :

S-PBGA-B357

JESD-609 Code :

e0

Supply Voltage-Min (Vsup) :

3.135V

Height Seated (Max) :

2.52mm

Peak Reflow Temperature (Cel) :

245

Co-Processors/DSP :

Communications; CPM

Low Power Mode :

yes

Terminal Form :

Ball

Address Bus Width :

32

Length :

25mm

Format :

FIXED POINT

Series :

MPC8xx

Terminal Position :

BOTTOM

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Integrated Cache :

yes

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Packaging :

Tray

Base Part Number :

MPC857

Time@Peak Reflow Temperature-Max (s) :

30

Operating Temperature :

0°C~105°C TA

RoHS Status :

Non-RoHS Compliant

Published :

2004

Bit Size :

32

Voltage - I/O :

3.3V

Graphics Acceleration :

No

Number of Terminations :

357

Terminal Pitch :

1.27mm

External Data Bus Width :

32

Ethernet :

10Mbps (1), 10/100Mbps (1)

Surface Mount :

yes

Supply Voltage :

3.3V

Terminal Finish :

Tin/Lead (Sn/Pb)

Supply Voltage-Max (Vsup) :

3.465V

RAM Controllers :

DRAM

Speed :

100MHz

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Package / Case :

357-BBGA

ECCN Code :

5A991

Boundary Scan :

yes

Number of Cores/Bus Width :

1 Core 32-Bit