MPC855TZQ66D4
- Mfr.Part #
- MPC855TZQ66D4
- Manufacturer
- Freescale Semiconductor
- Package / Case
- 357-BBGA
- Datasheet
- Download
- Description
- POWERQUICC 32 BIT POWER ARCHITEC
- Stock
- 6,697
- In Stock :
- 6,697
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- Manufacturer :
- Freescale Semiconductor
- Product Category :
- Microprocessors
- Boundary Scan :
- yes
- Co-Processors/DSP :
- Communications; CPM
- Voltage - I/O :
- 3.3V
- JESD-30 Code :
- S-PBGA-B357
- Supply Voltage-Max (Vsup) :
- 3.465V
- Number of Terminations :
- 357
- External Data Bus Width :
- 32
- Bit Size :
- 32
- Ethernet :
- 10Mbps (1), 10/100Mbps (1)
- HTS Code :
- 8542.31.00.01
- Speed :
- 66MHz
- Supply Voltage :
- 3.3V
- Peak Reflow Temperature (Cel) :
- 245
- Supply Voltage-Min (Vsup) :
- 3.135V
- ECCN Code :
- 3A991.A.2
- Power Supplies :
- 3.3V
- RAM Controllers :
- DRAM
- Low Power Mode :
- yes
- RoHS Status :
- Non-RoHS Compliant
- Length :
- 25mm
- Clock Frequency :
- 50MHz
- Terminal Position :
- BOTTOM
- Operating Temperature :
- 0°C~95°C TA
- Published :
- 1997
- Format :
- FIXED POINT
- Additional Interfaces :
- CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
- JESD-609 Code :
- e0
- Packaging :
- Tray
- Graphics Acceleration :
- No
- Base Part Number :
- MPC855
- Series :
- MPC8xx
- Height Seated (Max) :
- 2.52mm
- uPs/uCs/Peripheral ICs Type :
- MICROPROCESSOR, RISC
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Address Bus Width :
- 32
- Package / Case :
- 357-BBGA
- Integrated Cache :
- yes
- Number of Cores/Bus Width :
- 1 Core 32-Bit
- Surface Mount :
- yes
- Factory Lead Time :
- 12 Weeks
- Terminal Form :
- Ball
- Terminal Pitch :
- 1.27mm
- Datasheets
- MPC855TZQ66D4
MPC855TZQ66D4 Documents

1.27mm 3.3V 32-bit Microprocessor MPC8xx Series MPC855 3.3V 357-BBGA
MPC855TZQ66D4 Overview
The microprocessor is conveniently packaged in 357-BBGA, making it easy to ship internationally. High reliability is provided by the advanced packaging method Tray. There are 1 Core 32-Bit cores/bus width on the CPU. Understand the operating temperature around 0°C~95°C TA. The MPC8xx series contains it. DRAM RAM controllers are used by this CPU. This microprocessor has HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interfaces to serve you better. I/O is run at 3.3V on this CPU. This is a MICROPROCESSOR, RISC for the uPs/uCs/Peripheral ICs type. Try searching for variants of the cpu microprocessor with MPC855. Total terminations are 357. In the case of a 3.3V voltage supply, the embedded microprocessor should be turned on and run. A 32-Bit architecture is used. The maximum supply current is 3.465V. The external data bus width of this CPU is 32. 50MHz is the clock frequency of the embedded microprocessor. Datasheets specify that the embedded microprocessor requires 3.3V power supplies.
MPC855TZQ66D4 Features
32-Bit Structure
MPC855TZQ66D4 Applications
There are a lot of NXP USA Inc.
MPC855TZQ66D4 Microprocessor applications.
- Automatic control
- Equipment control
- Instrument control
- Consumer electronics products
- Toys
- Robots
- Radio
- Television
- Heater/Fan
- Calculator
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