MPC855TCZQ66D4

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Voltage - I/O :

3.3V

Terminal Pitch :

1.27mm

Co-Processors/DSP :

Communications; CPM

Factory Lead Time :

12 Weeks

Published :

1997

Package / Case :

357-BBGA

JESD-30 Code :

S-PBGA-B357

Bit Size :

32

HTS Code :

8542.31.00.01

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Integrated Cache :

yes

RoHS Status :

Non-RoHS Compliant

Number of Terminations :

357

JESD-609 Code :

e0

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Boundary Scan :

yes

ECCN Code :

3A991.A.2

Terminal Finish :

Tin/Lead/Silver (Sn/Pb/Ag)

Surface Mount :

yes

External Data Bus Width :

32

Supply Voltage-Min (Vsup) :

3.135V

Terminal Form :

Ball

Speed :

66MHz

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Length :

25mm

Ethernet :

10Mbps (1), 10/100Mbps (1)

Graphics Acceleration :

No

Peak Reflow Temperature (Cel) :

245

Packaging :

Tray

Address Bus Width :

32

RAM Controllers :

DRAM

Height Seated (Max) :

2.52mm

Low Power Mode :

yes

Format :

FIXED POINT

Power Supplies :

3.3V

Time@Peak Reflow Temperature-Max (s) :

30

Series :

MPC8xx

Supply Voltage-Max (Vsup) :

3.465V

Base Part Number :

MPC855

Terminal Position :

BOTTOM

Supply Voltage :

3.3V

Operating Temperature :

-40°C~95°C TA

Clock Frequency :

50MHz

Number of Cores/Bus Width :

1 Core 32-Bit