MPC850DEVR50BU

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Voltage - I/O :

3.3V

JESD-609 Code :

e1

Length :

23mm

Speed :

50MHz

Integrated Cache :

yes

Number of Cores/Bus Width :

1 Core 32-Bit

Time@Peak Reflow Temperature-Max (s) :

40

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Base Part Number :

MPC850

Number of Terminations :

256

Format :

FIXED POINT

Co-Processors/DSP :

Communications; CPM

HTS Code :

8542.31.00.01

Low Power Mode :

yes

Terminal Pitch :

1.27mm

Address Bus Width :

26

Packaging :

Tray

Power Supplies :

3.3V

Terminal Form :

Ball

Clock Frequency :

50MHz

USB :

USB 1.x (1)

Supply Voltage-Min (Vsup) :

3.135V

RoHS Status :

ROHS3 Compliant

Supply Voltage :

3.3V

Additional Interfaces :

HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART

Peak Reflow Temperature (Cel) :

260

Series :

MPC8xx

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Boundary Scan :

yes

External Data Bus Width :

32

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

ECCN Code :

3A991.A.2

Surface Mount :

yes

Terminal Position :

BOTTOM

Graphics Acceleration :

No

Bit Size :

32

Operating Temperature :

0°C~95°C TA

Published :

1997

Supply Voltage-Max (Vsup) :

3.465V

RAM Controllers :

DRAM

Ethernet :

10Mbps (1)

Package / Case :

256-BBGA

Height Seated (Max) :

2.35mm

JESD-30 Code :

S-PBGA-B256