MPC850DECZQ66BU

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Format :

FIXED POINT

Number of Terminations :

256

Integrated Cache :

yes

Published :

2004

Terminal Position :

BOTTOM

Supply Voltage-Min (Vsup) :

3V

RoHS Status :

Non-RoHS Compliant

Supply Voltage :

3.3V

Power Supplies :

3.3V

External Data Bus Width :

32

Voltage - I/O :

3.3V

Bit Size :

32

Low Power Mode :

yes

Operating Temperature :

-40°C~95°C TA

Time@Peak Reflow Temperature-Max (s) :

40

Height Seated (Max) :

2.54mm

Terminal Form :

Ball

Ethernet :

10Mbps (1)

Graphics Acceleration :

No

ECCN Code :

5A991

Base Part Number :

MPC850

Peak Reflow Temperature (Cel) :

260

Packaging :

Tray

Speed :

66MHz

JESD-609 Code :

e0

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Additional Interfaces :

HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

RAM Controllers :

DRAM

Package / Case :

256-BBGA

Surface Mount :

yes

Terminal Finish :

Tin/Lead (Sn/Pb)

Boundary Scan :

yes

Co-Processors/DSP :

Communications; CPM

Number of Cores/Bus Width :

1 Core 32-Bit

JESD-30 Code :

S-PBGA-B256

Terminal Pitch :

1.27mm

Series :

MPC8xx

Length :

23mm

Supply Voltage-Max (Vsup) :

3.6V

USB :

USB 1.x (1)

HTS Code :

8542.31.00.01

Address Bus Width :

26