MPC850DECZQ50BU

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Surface Mount :

yes

ECCN Code :

3A991.A.2

RoHS Status :

Non-RoHS Compliant

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Operating Temperature :

-40°C~95°C TA

Ethernet :

10Mbps (1)

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Power Supplies :

3.3V

Number of Terminations :

256

Base Part Number :

MPC850

Terminal Form :

Ball

Supply Voltage :

3.3V

Peak Reflow Temperature (Cel) :

260

Voltage - I/O :

3.3V

Packaging :

Tray

Terminal Position :

BOTTOM

RAM Controllers :

DRAM

JESD-609 Code :

e0

Length :

23mm

Terminal Pitch :

1.27mm

Low Power Mode :

yes

Time@Peak Reflow Temperature-Max (s) :

40

Series :

MPC8xx

Supply Voltage-Min (Vsup) :

3V

Boundary Scan :

yes

Factory Lead Time :

12 Weeks

Height Seated (Max) :

2.54mm

Package / Case :

256-BBGA

Graphics Acceleration :

No

External Data Bus Width :

32

Published :

1997

Address Bus Width :

26

Integrated Cache :

yes

Bit Size :

32

Format :

FIXED POINT

HTS Code :

8542.31.00.01

Speed :

50MHz

Supply Voltage-Max (Vsup) :

3.6V

USB :

USB 1.x (1)

Co-Processors/DSP :

Communications; CPM

Number of Cores/Bus Width :

1 Core 32-Bit

Terminal Finish :

Tin/Lead (Sn/Pb)

Additional Interfaces :

HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART

JESD-30 Code :

S-PBGA-B256