MPC850DECVR50BU

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

HTS Code :

8542.31.00.01

Published :

1997

JESD-30 Code :

S-PBGA-B256

Supply Voltage-Max (Vsup) :

3.6V

Terminal Form :

Ball

ECCN Code :

3A991.A.2

JESD-609 Code :

e1

Format :

FIXED POINT

Voltage - I/O :

3.3V

Package / Case :

256-BBGA

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Power Supplies :

3.3V

Additional Interfaces :

HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART

Number of Cores/Bus Width :

1 Core 32-Bit

RAM Controllers :

DRAM

Factory Lead Time :

12 Weeks

Packaging :

Tray

Integrated Cache :

yes

RoHS Status :

ROHS3 Compliant

Terminal Position :

BOTTOM

Peak Reflow Temperature (Cel) :

260

Surface Mount :

yes

Terminal Pitch :

1.27mm

Operating Temperature :

-40°C~95°C TA

Series :

MPC8xx

Bit Size :

32

Supply Voltage :

3.3V

Ethernet :

10Mbps (1)

Graphics Acceleration :

No

Co-Processors/DSP :

Communications; CPM

Length :

23mm

Boundary Scan :

yes

Time@Peak Reflow Temperature-Max (s) :

40

Address Bus Width :

26

Low Power Mode :

yes

USB :

USB 1.x (1)

Height Seated (Max) :

2.54mm

Number of Terminations :

256

Base Part Number :

MPC850

Supply Voltage-Min (Vsup) :

3V

External Data Bus Width :

32

Speed :

50MHz

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Moisture Sensitivity Level (MSL) :

3 (168 Hours)