MPC850CZQ50BU

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Format :

FIXED POINT

Base Part Number :

MPC850

JESD-609 Code :

e0

Supply Voltage :

3.3V

ECCN Code :

3A991.A.2

Length :

23mm

Supply Voltage-Max (Vsup) :

3.465V

Terminal Finish :

Tin/Lead (Sn/Pb)

Number of Terminations :

256

RAM Controllers :

DRAM

Voltage - I/O :

3.3V

Low Power Mode :

yes

External Data Bus Width :

32

Terminal Pitch :

1.27mm

Bit Size :

32

Power Supplies :

3.3V

Supply Voltage-Min (Vsup) :

3.135V

JESD-30 Code :

S-PBGA-B256

Terminal Form :

Ball

Additional Interfaces :

HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART

Factory Lead Time :

12 Weeks

Packaging :

Tray

Surface Mount :

yes

RoHS Status :

Non-RoHS Compliant

Peak Reflow Temperature (Cel) :

260

Co-Processors/DSP :

Communications; CPM

Series :

MPC8xx

Graphics Acceleration :

No

Operating Temperature :

-40°C~95°C TA

Package / Case :

256-BBGA

HTS Code :

8542.31.00.01

Integrated Cache :

yes

Clock Frequency :

50MHz

Boundary Scan :

yes

Height Seated (Max) :

2.35mm

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

USB :

USB 1.x (1)

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Address Bus Width :

26

Published :

1997

Ethernet :

10Mbps (1)

Number of Cores/Bus Width :

1 Core 32-Bit

Speed :

50MHz

Time@Peak Reflow Temperature-Max (s) :

40

Terminal Position :

BOTTOM