MPC8255ACVVMHBB

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Published :

1997

Surface Mount :

yes

Supply Voltage-Max (Vsup) :

2.7V

ECCN Code :

3A991.A.2

Height Seated (Max) :

1.65mm

Peak Reflow Temperature (Cel) :

260

Format :

Floating Point

RoHS Status :

ROHS3 Compliant

Supply Voltage-Min (Vsup) :

2.4V

Series :

MPC82xx

Supply Voltage :

2.5V

External Data Bus Width :

64

Terminal Pitch :

1.27mm

Packaging :

Tray

JESD-30 Code :

S-PBGA-B480

HTS Code :

8542.31.00.01

Length :

37.5mm

Low Power Mode :

yes

Voltage - I/O :

3.3V

Time@Peak Reflow Temperature-Max (s) :

40

Ethernet :

10/100Mbps (3)

Graphics Acceleration :

No

Core Processor :

PowerPC G2

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Number of Cores/Bus Width :

1 Core 32-Bit

Integrated Cache :

yes

Co-Processors/DSP :

Communications; RISC CPM

Operating Temperature :

-40°C~105°C TA

Factory Lead Time :

12 Weeks

Package / Case :

480-LBGA Exposed Pad

Terminal Position :

BOTTOM

Terminal Form :

Ball

Number of Terminations :

480

JESD-609 Code :

e1

RAM Controllers :

DRAM, SDRAM

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Speed :

266MHz

Base Part Number :

PC8255

Boundary Scan :

yes

Address Bus Width :

32

Moisture Sensitivity Level (MSL) :

3 (168 Hours)