MPC5566MVR132

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

HTS Code :

8542.31.00.01

Number of I/O :

256

Bit Size :

32

Peak Reflow Temperature (Cel) :

260

Terminal Form :

Ball

Connectivity :

CANbus, EBI/EMI, Ethernet, SCI, SPI

PWM Channels :

yes

JESD-609 Code :

e1

Package / Case :

416-BBGA

Mounting Type :

Surface Mount

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Supply Current-Max :

820mA

Published :

2007

ECCN Code :

3A991.A.2

RoHS Status :

ROHS3 Compliant

Voltage - Supply (Vcc/Vdd) :

1.35V~1.65V

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Series :

MPC55xx Qorivva

Clock Frequency :

20MHz

Time@Peak Reflow Temperature-Max (s) :

40

Height Seated (Max) :

2.55mm

Terminal Pitch :

1mm

Packaging :

Tray

JESD-30 Code :

S-PBGA-B416

Speed :

132MHz

Width :

27mm

External Data Bus Width :

32

Address Bus Width :

24

Has ADC :

yes

Terminal Position :

BOTTOM

Operating Temperature :

-40°C~125°C TA

Peripherals :

DMA, POR, PWM, WDT

Core Processor :

e200z6

Power Supplies :

1.53.35V

DAC Channels :

No

Supply Voltage :

1.5V

Oscillator Type :

External

Supply Voltage-Min (Vsup) :

1.35V

Length :

27mm

Number of Terminations :

416

Qualification Status :

Not Qualified

Core Size :

32-Bit

Program Memory Size :

3MB 3M x 8

Program Memory Type :

Flash

Factory Lead Time :

12 Weeks

Supply Voltage-Max (Vsup) :

1.65V

Data Converter :

A/D 40x12b

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

DMA Channels :

yes

ROM (words) :

3145728

Base Part Number :

PC5566

Additional Feature :

ALSO REQUIRES 3.3V SUPPLY

RAM Size :

128K x 8

Surface Mount :

yes