MPC5553MVZ132

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

JESD-30 Code :

S-PBGA-B324

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Factory Lead Time :

12 Weeks

Core Size :

32-Bit

Supply Voltage-Min (Vsup) :

1.35V

Qualification Status :

Not Qualified

Number of I/O :

220

DMA Channels :

No

Supply Voltage :

1.5V

ROM (words) :

1572864

Package / Case :

324-BBGA

Peripherals :

DMA, POR, PWM, WDT

Width :

23mm

Length :

23mm

Data Converter :

A/D 40x12b

Packaging :

Tray

Program Memory Type :

Flash

HTS Code :

8542.31.00.01

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Mounting Type :

Surface Mount

Series :

MPC55xx Qorivva

Peak Reflow Temperature (Cel) :

260

Voltage - Supply (Vcc/Vdd) :

1.35V~1.65V

Supply Voltage-Max (Vsup) :

1.65V

Program Memory Size :

1.5MB 1.5M x 8

RoHS Status :

ROHS3 Compliant

ECCN Code :

3A991.A.2

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER

Surface Mount :

yes

Terminal Position :

BOTTOM

Number of Terminations :

324

DAC Channels :

No

Core Processor :

e200z6

Connectivity :

CANbus, EBI/EMI, Ethernet, SCI, SPI

Oscillator Type :

External

Speed :

132MHz

PWM Channels :

yes

Operating Temperature :

-40°C~125°C TA

Height Seated (Max) :

2.55mm

JESD-609 Code :

e1

Supply Current-Max :

510mA

External Data Bus Width :

32

Address Bus Width :

24

Power Supplies :

1.53.35V

Base Part Number :

PC5553

Published :

2003

Time@Peak Reflow Temperature-Max (s) :

40

Clock Frequency :

20MHz

Additional Feature :

ALSO REQUIRES 3.3V SUPPLY

RAM Size :

64K x 8

Bit Size :

32

Terminal Pitch :

1mm

Terminal Form :

Ball

Has ADC :

yes