MK65FN2M0VMI18R

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Width :

9mm

ECCN Code :

3A991.A.2

Bit Size :

32

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

JESD-30 Code :

S-PBGA-B169

Terminal Position :

BOTTOM

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Series :

Kinetis K60

Program Memory Type :

Flash

Mounting Type :

Surface Mount

RAM Size :

256K x 8

Clock Frequency :

50MHz

Operating Temperature :

-40°C~105°C TA

Packaging :

Tape and Reel (TR)

Height Seated (Max) :

1.28mm

DAC Channels :

yes

Peripherals :

DMA, I2S, LVD, POR, PWM, WDT

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Supply Voltage-Min (Vsup) :

1.71V

External Data Bus Width :

32

Terminal Form :

Ball

Supply Voltage-Max (Vsup) :

3.6V

Number of I/O :

116

Published :

2002

Length :

9mm

DMA Channels :

yes

Data Converter :

A/D 2x16b; D/A 2x12b

Factory Lead Time :

13 Weeks

Core Processor :

ARM® Cortex®-M4

Package / Case :

169-LFBGA

Voltage - Supply (Vcc/Vdd) :

1.71V~3.6V

Core Size :

32-Bit

Speed :

180MHz

Supply Voltage :

3V

On Chip Program ROM Width :

8

PWM Channels :

yes

Oscillator Type :

Internal

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

HTS Code :

8542.31.00.01

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

Address Bus Width :

15

Surface Mount :

yes

Has ADC :

yes

Number of Terminations :

169

Terminal Pitch :

0.65mm

RoHS Status :

ROHS3 Compliant

Program Memory Size :

2MB 2M x 8