MK63FN1M0VMD12

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Length :

13mm

Has ADC :

yes

Program Memory Size :

1MB 1M x 8

Speed :

120MHz

Terminal Pitch :

1mm

Supply Voltage-Max (Vsup) :

3.6V

Clock Frequency :

50MHz

RoHS Status :

ROHS3 Compliant

Oscillator Type :

Internal

Terminal Position :

BOTTOM

Series :

Kinetis K60

Data Converter :

A/D 41x16b; D/A 2x12b

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

Number of I/O :

95

DMA Channels :

yes

Operating Temperature :

-40°C~105°C TA

Number of Terminations :

144

Program Memory Type :

Flash

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Supply Voltage-Min (Vsup) :

1.71V

Packaging :

Tray

Core Processor :

ARM® Cortex®-M4

Surface Mount :

yes

Package / Case :

144-LBGA

HTS Code :

8542.31.00.01

Bit Size :

32

RAM Size :

256K x 8

Factory Lead Time :

13 Weeks

Voltage - Supply (Vcc/Vdd) :

1.71V~3.6V

Terminal Form :

Ball

Mounting Type :

Surface Mount

DAC Channels :

yes

Supply Voltage :

3.3V

Peripherals :

DMA, I2S, LVD, POR, PWM, WDT

PWM Channels :

yes

Peak Reflow Temperature (Cel) :

260

JESD-30 Code :

S-PBGA-B144

Width :

13mm

Time@Peak Reflow Temperature-Max (s) :

40

Published :

2012

JESD-609 Code :

e1

Core Size :

32-Bit

ECCN Code :

3A991.A.2

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)