MK51DN512ZCMC10

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Peak Reflow Temperature (Cel) :

260

Data Converter :

A/D 37x16b; D/A 2x12b

Length :

8mm

Connectivity :

I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG

Qualification Status :

Not Qualified

Terminal Pitch :

0.65mm

Terminal Form :

Ball

Mounting Type :

Surface Mount

Bit Size :

32

Package / Case :

121-LFBGA

Supply Voltage-Max (Vsup) :

3.6V

Number of Terminations :

121

Operating Temperature :

-40°C~85°C TA

HTS Code :

8542.31.00.01

Surface Mount :

yes

RoHS Status :

ROHS3 Compliant

JESD-609 Code :

e1

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Height Seated (Max) :

1.52mm

PWM Channels :

yes

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Published :

2002

Program Memory Size :

512KB 512K x 8

Packaging :

Tray

Series :

Kinetis K50

DAC Channels :

yes

Number of I/O :

78

Peripherals :

DMA, I2S, PWM, WDT

ECCN Code :

3A991.A.2

Terminal Position :

BOTTOM

Width :

8mm

Core Size :

32-Bit

Time@Peak Reflow Temperature-Max (s) :

40

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Voltage - Supply (Vcc/Vdd) :

1.71V~3.6V

Supply Voltage-Min (Vsup) :

1.71V

Has ADC :

yes

DMA Channels :

yes

Core Processor :

ARM® Cortex®-M4

JESD-30 Code :

S-PBGA-B121

Supply Voltage :

3.3V

Clock Frequency :

50MHz

Oscillator Type :

Internal

RAM Size :

128K x 8

Base Part Number :

MK51DN512

Program Memory Type :

Flash

Speed :

100MHz