MK50DX256CMC10

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Speed :

100MHz

Supply Voltage-Max (Vsup) :

3.6V

DAC Channels :

yes

Power Supplies :

1.8/3.3V

Surface Mount :

yes

Number of Terminations :

121

Voltage - Supply (Vcc/Vdd) :

1.71V~3.6V

JESD-30 Code :

S-PBGA-B121

Peripherals :

DMA, I2S, LVD, POR, PWM, WDT

PWM Channels :

yes

Number of I/O :

78

Terminal Pitch :

0.65mm

Bit Size :

32

Connectivity :

I²C, IrDA, LINbus, SPI, UART/USART

ECCN Code :

3A991.A.2

JESD-609 Code :

e1

Terminal Finish :

TIN SILVER COPPER

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Core Size :

32-Bit

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

HTS Code :

8542.31.00.01

Width :

8mm

CPU Family :

CORTEX-M4

Qualification Status :

Not Qualified

Peak Reflow Temperature (Cel) :

260

Core Processor :

ARM® Cortex®-M4

Supply Current-Max :

77mA

Program Memory Type :

Flash

Height Seated (Max) :

1.52mm

Supply Voltage-Min (Vsup) :

1.71V

Program Memory Size :

256KB 256K x 8

EEPROM Size :

4K x 8

Clock Frequency :

32MHz

Oscillator Type :

Internal

ROM (words) :

262144

Factory Lead Time :

13 Weeks

Published :

2002

Base Part Number :

MK50DX256

Mounting Type :

Surface Mount

DMA Channels :

yes

Supply Voltage :

3.3V

Has ADC :

yes

Packaging :

Tray

RAM Size :

64K x 8

Data Converter :

A/D 27x16b; D/A 2x12b

Time@Peak Reflow Temperature-Max (s) :

40

Terminal Form :

Ball

Series :

Kinetis K50

Package / Case :

121-LFBGA

Operating Temperature :

-40°C~85°C TA

Terminal Position :

BOTTOM

RoHS Status :

ROHS3 Compliant

Length :

8mm