MK26FN2M0CAC18R

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

RAM (bytes) :

262144

Program Memory Size :

2MB 2M x 8

Factory Lead Time :

16 Weeks

Supply Voltage-Max (Vsup) :

3.6V

Operating Temperature :

-40°C~85°C TA

Terminal Position :

BOTTOM

ECCN Code :

3A991.A.2

RAM Size :

256K x 8

Supply Voltage-Min (Vsup) :

1.71V

Surface Mount :

yes

Has ADC :

yes

PWM Channels :

yes

Terminal Form :

Ball

Bit Size :

32

Number of I/O :

116

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

Speed :

180MHz

Qualification Status :

Not Qualified

HTS Code :

8542.31.00.01

Terminal Pitch :

0.4mm

Package / Case :

169-UFBGA, WLCSP

Program Memory Type :

Flash

Core Size :

32-Bit

Clock Frequency :

50MHz

Supply Current-Max :

106.75mA

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Width :

5.5mm

DMA Channels :

yes

RoHS Status :

ROHS3 Compliant

Length :

5.6mm

Mounting Type :

Surface Mount

Peripherals :

DMA, I2S, LVD, POR, PWM, WDT

Supply Voltage :

3.3V

Voltage - Supply (Vcc/Vdd) :

1.71V~3.6V

DAC Channels :

yes

Data Converter :

A/D 5x12b, 6x16b; D/A 2x12b

Packaging :

Tape and Reel (TR)

Core Processor :

ARM® Cortex®-M4

Oscillator Type :

Internal

Number of Terminations :

169

Series :

Kinetis K20

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

CPU Family :

CORTEX-M4F

JESD-30 Code :

R-PBGA-B169

ROM (words) :

2097152

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Published :

2002

Power Supplies :

1.8/3.3V