MDV1-25SS
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- Mfr.Part #
- MDV1-25SS
- Manufacturer
- ITT Cannon
- Package / Case
- Datasheet
- Download
- Description
- CONN MICRO-D RCPT 25POS PNL MNT
- Stock
- 31,148
- In Stock ：
- 31,148
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- Manufacturer :
- ITT Cannon
- Product Category :
- D-Sub Connector Assemblies
- Housing Material :
- Polyester, Glass Filled
- Voltage Rating :
- --
- Connector Type :
- Receptacle, Female Sockets
- Ingress Protection :
- --
- Series :
- MDV
- Color :
- --
- Connector Style :
- D-Type, Micro-D
- Withdrawl Force-Min :
- .139 N
- Operating Temperature :
- -65°C~125°C
- Number of Positions :
- 25
- Flange Feature :
- Housing/Shell (Unthreaded)
- RoHS Status :
- RoHS Compliant
- Backset Spacing :
- --
- Manufacturer :
- ITT Cannon
- Insulation Resistance :
- 5000000000Ohm
- Body Depth :
- 0.171 inch
- Mating Contact Row Spacing :
- 0.043 inch
- Contact Finish :
- Gold
- Insulation Material :
- GLASS FILLED POLYESTER
- Material Flammability Rating :
- --
- Mounting Type :
- Panel Mount
- Published :
- 2006
- Wire Gauge :
- --
- Packaging :
- Bulk
- Product Type :
- Micro-D D-Sub Connectors
- Shell Material, Finish :
- Thermoplastic
- Package :
- Bulk
- Contact Resistance :
- 10MOhm
- Contact Form :
- --
- Total Number of Contacts :
- 25
- HTS Code :
- 8536.69.40.30
- Brand :
- ITT Cannon
- Contact Finish Thickness :
- --
- ECCN Code :
- EAR99
- Shell Size, Connector Layout :
- 0.050 Pitch x 0.043 Row to Row
- Features :
- --
- RoHS :
- Non-Compliant
- Number of Rows :
- 2
- Termination :
- Solder Cup
- Contact Material :
- COPPER ALLOY
- Mounting Option 2 :
- NON-THREADED
- Contact Design :
- PREASSEM CONN
- Product Status :
- Active
- Reliability :
- COMMERCIAL
- Dielectric Material :
- Polyester Thermoplastic, Glass Filled
- Contact Type :
- Signal
- Factory Lead Time :
- 11 Weeks
- Mounting Option 1 :
- HOLE .087-.098
- Current Rating :
- 3A
- Product Category :
- D-Sub Micro-D Connectors
- Current Rating (Amps) :
- 3A
- Mating Contact Pitch :
- 0.05 inch
- Datasheets
- MDV1-25SS
MDV1-25SS Documents
MDV Series D-Type, Micro-D Receptacle, Female Sockets 25-Position Signal Solder Cup 0.050 Pitch x 0.043 Row to Row Panel Mount Copper Alloy Gold Thermoplastic
MDV1-25SS Overview
A Receptacle, Female Sockets package is included with it.Panel Mount indicates that the device is mounted.An Bulk case is utilized for packaging the product.The product is a part of the MDV Series.Operating temperature is set to -65°C~125°C.
MDV1-25SS Features
MDV series
MDV1-25SS Applications
There are a lot of ITT Cannon, LLC
MDV1-25SS D-Sub Connectors applications.
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
- Blowers
- Control panels
You may place an order without registering to Chip IC. We strongly recommend that you log in before purchasing as you can track your order at any time.
RFQ (Request for Quotations)It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.
Payment MethodFor your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.
IMPORTANT NOTICEYou may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.
Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
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