MDV1-25SS
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- Mfr.Part #
- MDV1-25SS
- Manufacturer
- ITT Cannon
- Package / Case
- Datasheet
- Download
- Description
- CONN MICRO-D RCPT 25POS PNL MNT
- Stock
- 31,148
- In Stock ：
- 31,148
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- Manufacturer :
- ITT Cannon
- Product Category :
- D-Sub Connector Assemblies
- Connector Style :
- D-Type, Micro-D
- Package :
- Bulk
- Contact Finish :
- Gold
- HTS Code :
- 8536.69.40.30
- Dielectric Material :
- Polyester Thermoplastic, Glass Filled
- Connector Type :
- Receptacle, Female Sockets
- Series :
- MDV
- Withdrawl Force-Min :
- .139 N
- Mounting Type :
- Panel Mount
- Contact Form :
- --
- Color :
- --
- Mating Contact Pitch :
- 0.05 inch
- Product Type :
- Micro-D D-Sub Connectors
- Contact Material :
- COPPER ALLOY
- Insulation Resistance :
- 5000000000Ohm
- Shell Size, Connector Layout :
- 0.050 Pitch x 0.043 Row to Row
- Mounting Option 2 :
- NON-THREADED
- Insulation Material :
- GLASS FILLED POLYESTER
- Termination :
- Solder Cup
- Total Number of Contacts :
- 25
- Product Status :
- Active
- Mounting Option 1 :
- HOLE .087-.098
- Current Rating :
- 3A
- ECCN Code :
- EAR99
- Factory Lead Time :
- 11 Weeks
- Body Depth :
- 0.171 inch
- Contact Type :
- Signal
- Number of Rows :
- 2
- Current Rating (Amps) :
- 3A
- Wire Gauge :
- --
- Housing Material :
- Polyester, Glass Filled
- Ingress Protection :
- --
- Product Category :
- D-Sub Micro-D Connectors
- Contact Design :
- PREASSEM CONN
- Published :
- 2006
- Packaging :
- Bulk
- Features :
- --
- Contact Resistance :
- 10MOhm
- Mating Contact Row Spacing :
- 0.043 inch
- Voltage Rating :
- --
- Shell Material, Finish :
- Thermoplastic
- Manufacturer :
- ITT Cannon
- Material Flammability Rating :
- --
- Number of Positions :
- 25
- Reliability :
- COMMERCIAL
- Brand :
- ITT Cannon
- Operating Temperature :
- -65°C~125°C
- Flange Feature :
- Housing/Shell (Unthreaded)
- Contact Finish Thickness :
- --
- RoHS Status :
- RoHS Compliant
- RoHS :
- Non-Compliant
- Backset Spacing :
- --
- Datasheets
- MDV1-25SS
MDV1-25SS Documents
MDV Series D-Type, Micro-D Receptacle, Female Sockets 25-Position Signal Solder Cup 0.050 Pitch x 0.043 Row to Row Panel Mount Copper Alloy Gold Thermoplastic
MDV1-25SS Overview
A Receptacle, Female Sockets package is included with it.Panel Mount indicates that the device is mounted.An Bulk case is utilized for packaging the product.The product is a part of the MDV Series.Operating temperature is set to -65°C~125°C.
MDV1-25SS Features
MDV series
MDV1-25SS Applications
There are a lot of ITT Cannon, LLC
MDV1-25SS D-Sub Connectors applications.
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
- Blowers
- Control panels
You may place an order without registering to Chip IC. We strongly recommend that you log in before purchasing as you can track your order at any time.
RFQ (Request for Quotations)It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.
Payment MethodFor your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.
IMPORTANT NOTICEYou may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.
Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
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