MDM-51SSF
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- Mfr.Part #
- MDM-51SSF
- Manufacturer
- ITT Cannon
- Package / Case
- SOD
- Datasheet
- Download
- Description
- CONN MICRO-D RCPT 51POS PNL MNT
- Stock
- 1,357
- In Stock ：
- 1,357
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- Manufacturer :
- ITT Cannon
- Product Category :
- D-Sub Connector Assemblies
- Features :
- Shielded
- Operating Temperature :
- -55°C~125°C
- Ingress Protection :
- --
- Number of Positions :
- 51
- Contact Form :
- --
- Termination :
- Solder Cup
- Number of Rows :
- 3
- Contact Finish Thickness :
- --
- Package :
- Bulk
- Contact Type :
- Signal
- Mount :
- Panel
- Contact Finish :
- Gold
- Contact Material :
- COPPER ALLOY
- Flange Feature :
- Housing/Shell (Unthreaded)
- Current Rating (Amps) :
- 3A
- Wire Gauge :
- --
- Dielectric Material :
- Liquid Crystal Polymer (LCP)
- Feature :
- Shielded
- Length :
- 36.45mm
- Voltage Rating :
- --
- Factory Lead Time :
- 12 Weeks
- Packaging :
- Bulk
- Backset Spacing :
- --
- RoHS Status :
- Non-RoHS Compliant
- Contact Style :
- Socket
- Product Status :
- Active
- Connector Type :
- Receptacle, Female Sockets
- Color :
- Black
- Connector Style :
- D-Type, Micro-D
- Package / Case :
- SOD
- Material Flammability Rating :
- --
- Series :
- 83513-Style Micro D Metal Shell (MDM)
- Shell Size, Connector Layout :
- 0.050 Pitch x 0.043 Row to Row
- Depth :
- 15.17mm
- Base Product Number :
- MDM-5
- Shell Material, Finish :
- Aluminum, Yellow Chromate Plated Cadmium
- Housing Material :
- Polymer
- Gender :
- FEMALE
- Radiation Hardening :
- No
- Orientation :
- Straight
- Current Rating :
- 3A
- Published :
- 2011
- Number of Ports :
- 1
- Mounting Type :
- Panel Mount
- Datasheets
- MDM-51SSF
83513-Style Micro D Metal Shell (MDM) Series D-Type, Micro-D Receptacle, Female Sockets 51-Position Female Signal Solder Cup 0.050 Pitch x 0.043 Row to Row Panel Mount Copper Alloy Gold Aluminum, Yellow Chromate Plated Cadmium
MDM-51SSF Overview
It comes in Receptacle, Female Sockets packaging.There is a mounting type of Panel Mount for this device.It is necessary to use a Bulk case for packaging the product.This product is part of the 83513-Style Micro D Metal Shell (MDM) Series.The packaging with the SOD contains a device.A variety of tasks can be managed through its 1 ports.In many ways, its Shielded feature makes it more powerful.Panel is used to mount the part.In this case, the device operates at -55°C~125°C Operating Temperature.
MDM-51SSF Features
83513-Style Micro D Metal Shell (MDM) series
MDM-51SSF Applications
There are a lot of ITT Cannon, LLC
MDM-51SSF D-Sub Connectors applications.
- Transportation
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
You may place an order without registering to Chip IC. We strongly recommend that you log in before purchasing as you can track your order at any time.
RFQ (Request for Quotations)It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.
Payment MethodFor your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.
IMPORTANT NOTICEYou may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.
Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
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