MDF7C-20DP-2.54DSA(55)

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Mfr.Part #
MDF7C-20DP-2.54DSA(55)
Manufacturer
Hirose
Package / Case
Datasheet
Download
Description
CONN HDR 20POS 0.1 STACK T/H TIN
Stock
46,490
In Stock :
46,490

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Manufacturer :
Hirose
Product Category :
Board Spacers, Stackers (Board to Board)
Number of Positions :
20
Contact Plating :
Tin
Color :
Black, Gray
Length - Tail :
0.138 3.500mm
Length - Overall Pin :
0.984 25.000mm
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Length :
24.9936mm
Number of Pins :
20
Length - Stack Height :
0.728 18.500mm
Mount :
Through Hole
Pitch :
0.100 2.54mm
Packaging :
Bulk
Contact Finish - Post (Mating) :
Tin
Factory Lead Time :
10 Weeks
Series :
MDF7
Length - Post (Mating) :
0.118 3.000mm
RoHS Status :
RoHS Compliant
Row Spacing :
0.100 (2.54mm)
Mounting Type :
Through Hole
Termination :
Solder
Number of Rows :
2
Introducing Board Spacers, Stackers (Board to Board) Hirose MDF7C-20DP-2.54DSA(55) from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:20, Mounting Type:Through Hole, MDF7C-20DP-2.54DSA(55) pinout, MDF7C-20DP-2.54DSA(55) datasheet PDF, MDF7C-20DP-2.54DSA(55) amp .Beyond Board Spacers, Stackers (Board to Board) Hirose MDF7C-20DP-2.54DSA(55) ,we also offer ZW-01-09-S-S-425-200, TW-02-02-T-S-200-088, ZW-03-15-T-S-315-158, Our vast inventory has you covered. Contact us now for immediate solutions.



MDF7 Series 2 Rows Solder 0.100 2.54mm Bulk Through Hole 20 Positions Black, Gray

MDF7C-20DP-2.54DSA(55) Overview


The mounting type of the device is Through Hole.A Bulk case is used to package the product.A product of the MDF7 Series, it belongs to the range of products of that series.20 pins are on the device.

MDF7C-20DP-2.54DSA(55) Features


MDF7 series


MDF7C-20DP-2.54DSA(55) Applications


There are a lot of Hirose Electric Co Ltd
MDF7C-20DP-2.54DSA(55) Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology
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