MDF7B-18P-2.54DSA(13)

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Mfr.Part #
MDF7B-18P-2.54DSA(13)
Manufacturer
Hirose
Package / Case
Datasheet
Download
Description
CONN HDR 18POS 0.1 STACK T/H
Stock
27,873
In Stock :
27,873

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Manufacturer :
Hirose
Product Category :
Board Spacers, Stackers (Board to Board)
Termination :
Solder
Mounting Type :
Through Hole
Color :
Black, Gray
Mount :
Through Hole
Factory Lead Time :
10 Weeks
Number of Positions :
18
Contact Plating :
Gold
Length :
20.447mm
Contact Finish - Post (Mating) :
Gold
Length - Post (Mating) :
0.118 3.000mm
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Number of Pins :
18
Length - Stack Height :
0.530 13.450mm
Length - Overall Pin :
0.805 20.450mm
Pitch :
0.100 2.54mm
RoHS Status :
RoHS Compliant
Packaging :
Bulk
Number of Rows :
1
Contact Finish Thickness - Post (Mating) :
8.00μin 0.203μm
Length - Tail :
0.118 3.000mm
Series :
MDF7
Introducing Board Spacers, Stackers (Board to Board) Hirose MDF7B-18P-2.54DSA(13) from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Through Hole, Number of Pins:18, MDF7B-18P-2.54DSA(13) pinout, MDF7B-18P-2.54DSA(13) datasheet PDF, MDF7B-18P-2.54DSA(13) amp .Beyond Board Spacers, Stackers (Board to Board) Hirose MDF7B-18P-2.54DSA(13) ,we also offer ZW-01-09-S-S-425-200, TW-02-02-T-S-200-088, ZW-03-15-T-S-315-158, Our vast inventory has you covered. Contact us now for immediate solutions.



MDF7 Series 1 Rows Solder 0.100 2.54mm Bulk Through Hole 18 Positions Black, Gray

MDF7B-18P-2.54DSA(13) Overview


There is a Through Hole mounting type for the device.This product is packaged in a case marked Bulk.Product number MDF7 belongs to the MDF7 Series.A 18 pin is provided on the device.

MDF7B-18P-2.54DSA(13) Features


MDF7 series


MDF7B-18P-2.54DSA(13) Applications


There are a lot of Hirose Electric Co Ltd
MDF7B-18P-2.54DSA(13) Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology
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