MCZ33905BS3EKR2
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- Mfr.Part #
- MCZ33905BS3EKR2
- Manufacturer
- NXP Semiconductors
- Package / Case
- 32-SSOP (0.295, 7.50mm Width) Exposed Pad
- Datasheet
- Download
- Description
- IC INTERFACE SPECIALIZED 32SOIC
- Stock
- 11,582
- In Stock ：
- 11,582
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- Manufacturer :
- NXP Semiconductors
- Product Category :
- Specialized
- Number of Terminations :
- 32
- Length :
- 11mm
- Applications :
- System Basis Chip
- Operating Temperature (Min) :
- -40°C
- Number of Functions :
- 1
- Height Seated (Max) :
- 2.45mm
- Temperature Grade :
- Automotive
- Terminal Pitch :
- 0.65mm
- Operating Temperature (Max) :
- 125°C
- Packaging :
- Tape and Reel (TR)
- Adjustable Threshold :
- yes
- Supply Voltage :
- 10.5V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Channels :
- 1
- Mounting Type :
- Surface Mount
- RoHS Status :
- ROHS3 Compliant
- Width :
- 7.5mm
- Published :
- 2011
- Supply Voltage-Min (Vsup) :
- 5.5V
- Supply Voltage-Max (Vsup) :
- 28V
- Voltage - Supply :
- 5.5V~28V
- Package / Case :
- 32-SSOP (0.295, 7.50mm Width) Exposed Pad
- Terminal Form :
- Gull wing
- JESD-30 Code :
- R-PDSO-G32
- Base Part Number :
- MCZ33905
- Interface :
- CAN, LIN
- Surface Mount :
- yes
- Terminal Position :
- Dual
- Analog IC - Other Type :
- POWER SUPPLY MANAGEMENT CIRCUIT
- Datasheets
- MCZ33905BS3EKR2
Specialized NXP Semiconductors MCZ33905BS3EKR2 Overview
The Specialized NXP Semiconductors MCZ33905BS3EKR2 is a state-of-the-art integrated circuit designed for specialized interface applications within various automotive environments. This robust component ensures reliable communication in network systems requiring high-speed data exchanges and diagnostics. Crafted by NXP Semiconductors, a leader in the field, this IC offers exceptional durability and performance under stringent conditions. Its compact 32SOIC package enables streamlined integration into existing automotive systems, making it an indispensable tool for developers and manufacturers aiming to enhance vehicle communications infrastructure.
MCZ33905BS3EKR2 Features
This IC boasts a range of features suited for high-demand systems, including advanced system basis chip capabilities which facilitate power management and CAN transceiver functions. It supports high-speed communication up to 1 Mbps, and includes fail-safe mechanisms that enhance overall system reliability. Its low-power consumption and broad operational temperature range make it ideal for automotive applications subjected to extreme environments.
MCZ33905BS3EKR2 Applications
- Automotive Body Control: Integrates seamlessly into systems managing door control, lighting, and other body electronics, ensuring reliable communication and control.
- Powertrain Systems: Used in managing communications between various sensors and actuators in engine and transmission systems, improving performance and efficiency.
- Infotainment Systems: Provides the backbone for data transfer in sophisticated infotainment systems, supporting a robust network for multimedia sharing.
- Diagnostic Systems: Essential in automotive diagnostics, facilitating the communication required for maintenance and error reporting.
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