MCP619-I/SLVAO

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Mfr.Part #
MCP619-I/SLVAO
Manufacturer
Microchip Technology
Package / Case
14-SOIC (0.154, 3.90mm Width)
Datasheet
Download
Description
IC CMOS 4 CIRCUIT 14SOIC
Stock
4,774
In Stock :
4,774

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Manufacturer :
Microchip Technology
Product Category :
Instrumentation, OP Amps, Buffer Amps
Product Status :
Active
Operating Temperature :
-40°C~85°C
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Output Type :
Rail-to-Rail
Unity Gain BW-Nom :
190 kHz
Current - Input Bias :
15nA
Base Part Number :
MCP619
Terminal Form :
Gull wing
Slew Rate :
0.08V/µs
Supply Voltage :
5V
Package / Case :
14-SOIC (0.154, 3.90mm Width)
Number of Terminations :
14
Common Mode Rejection Ratio :
100 dB
Supply Voltage Limit-Max :
7V
Surface Mount :
yes
Amplifier Type :
GENERAL PURPOSE
Supplier Device Package :
14-SOIC
Series :
Automotive, AEC-Q100
Number of Functions :
4
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Terminal Position :
Dual
Package :
Tube
Gain Bandwidth Product :
190kHz
Mounting Type :
Surface Mount
Packaging :
Tube
Number of Circuits :
4
Voltage - Supply, Single/Dual (±) :
2.3V~5.5V
Height Seated (Max) :
1.75mm
Length :
8.65mm
RoHS Status :
ROHS3 Compliant
Base Product Number :
MCP619
Current - Output / Channel :
17 mA
Voltage - Input Offset :
150μV
Average Bias Current-Max (IIB) :
0.005μA
Current - Supply :
19μA
Terminal Pitch :
1.27mm
Datasheets
MCP619-I/SLVAO
Introducing Instrumentation, OP Amps, Buffer Amps Microchip Technology MCP619-I/SLVAO from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C, Base Part Number:MCP619, Package / Case:14-SOIC (0.154, 3.90mm Width), Number of Terminations:14, Mounting Type:Surface Mount, MCP619-I/SLVAO pinout, MCP619-I/SLVAO datasheet PDF, MCP619-I/SLVAO amp .Beyond Instrumentation, OP Amps, Buffer Amps Microchip Technology MCP619-I/SLVAO ,we also offer OP07CDR, TS321CX5 RFG, NE5532ADR, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology MCP619-I/SLVAO


Instrumentation, OP Amps, Buffer Amps Microchip Technology MCP619-I/SLVAO Overview

Introducing the MCP619-I/SLVAO from Microchip Technology, a leading name in the realm of integrated circuits. This cutting-edge IC, boasting CMOS technology, features four circuits encapsulated in a 14SOIC package. Designed with precision and efficiency in mind, this component stands out as a pinnacle of quality and performance.

Engineered to meet the rigorous demands of modern electronics, the MCP619-I/SLVAO excels in a variety of applications. Its versatility and reliability make it an indispensable tool for professionals seeking top-tier solutions in instrumentation, operational amplifiers, and buffer amplifiers.

MCP619-I/SLVAO Features

  • CMOS technology for enhanced performance and efficiency
  • Four circuits integrated into a compact 14SOIC package
  • Precision design ensures accuracy and reliability
  • Wide range of operating voltages for flexibility in different applications
  • Low power consumption for energy-efficient operation
  • Robust construction for durability in demanding environments

MCP619-I/SLVAO Applications

  • Medical Devices: The MCP619-I/SLVAO is utilized in various medical instruments and devices for signal processing, ensuring accurate readings and reliable performance in critical healthcare applications.
  • Industrial Automation: In industrial automation systems, this component serves as a key component in control circuits, providing precise amplification and buffering for sensor signals, thereby enhancing overall system efficiency and productivity.
  • Audio Equipment: Audio amplifiers and signal processing equipment benefit from the MCP619-I/SLVAO's high-performance capabilities, delivering clear, distortion-free sound reproduction in audio systems, professional recording studios, and entertainment venues.
  • Communication Systems: From telecommunications to data transmission, the MCP619-I/SLVAO plays a vital role in signal conditioning and amplification, ensuring reliable communication across various platforms and networks.
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