MCP25025T-I/SL
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- Mfr.Part #
- MCP25025T-I/SL
- Manufacturer
- Microchip Technology
- Package / Case
- 14-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- IC I/O EXPANDER CAN 8B 14SOIC
- Stock
- 15,221
- In Stock ：
- 15,221
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- Manufacturer :
- Microchip Technology
- Product Category :
- I/O Expanders
- Pbfree Code :
- yes
- JESD-609 Code :
- e3
- Package Shape :
- RECTANGULAR
- ECCN Code :
- EAR99
- Seated Height-Max :
- 1.75 mm
- Width :
- 3.9mm
- Mounting :
- Surface Mount
- Temperature Grade :
- Industrial
- Mount :
- Surface Mount
- uPs/uCs/Peripheral ICs Type :
- MICROPROCESSOR CIRCUIT
- Number of Transceivers :
- 1
- Maximum Data Rate :
- 1 Mbps
- Mounting Type :
- Surface Mount
- Number of Terminals :
- 14
- RoHS Status :
- ROHS3 Compliant
- Factory Lead Time :
- 8 Weeks
- Terminal Position :
- Dual
- Interrupt Output :
- No
- Output Type :
- Push-Pull
- Operating Supply Voltage :
- 5.5, 2.7 V
- Package / Case :
- 14-SOIC (0.154, 3.90mm Width)
- Number of Bits :
- 8
- Data Rate :
- 1 Mbps
- Terminal Form :
- Gull wing
- Published :
- 2007
- Time@Peak Reflow Temperature-Max (s) :
- 40
- JESD-30 Code :
- R-PDSO-G14
- Number of Pins :
- 14
- Qualification Status :
- Not Qualified
- Screening Level :
- Industrial
- Base Product Number :
- MCP25025
- Terminal Finish :
- Matte Tin (Sn)
- HTS Code :
- 8542.39.00.01
- Packaging :
- Tape and Reel (TR)
- Number of Terminations :
- 14
- Supply Voltage :
- 5V
- Reach Compliance Code :
- Compliant
- Brand :
- Microchip Technology
- Surface Mount :
- yes
- Supplier Package :
- SOIC N
- Maximum Operating Temperature :
- + 150 C
- Supplier Device Package :
- 14-SOIC
- Product Category :
- Interface - I/O Expanders
- Clock Frequency :
- 4MHz
- RoHS :
- Details
- Minimum Operating Temperature :
- - 65 C
- Length :
- 8.65 mm
- Nominal Supply Current :
- 20mA
- Features :
- EEPROM, POR, PWM
- Lead Free :
- Lead Free
- Interface :
- CAN (1-Wire)
- Manufacturer :
- Microchip
- Max Supply Current :
- 20mA
- Power Down Mode :
- Sleep
- Operating Temperature :
- -40°C~85°C
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Pin Count :
- 14
- Peak Reflow Temperature (Cel) :
- 260
- Base Part Number :
- MCP25025
- Feature :
- EEPROM, POR, PWM
- Terminal Pitch :
- 1.27 mm
- Product Status :
- Active
- Operating Supply Current :
- 20 mA
- Current - Output Source/Sink :
- 25mA
- Product Type :
- I/O Expanders
- Series :
- --
- Mounting Style :
- SMD/SMT
- Standard Supported :
- CAN 2.0B
- Package :
- Tape and Reel (TR)
- Power Supplies :
- 3/5V
- Voltage - Supply :
- 2.7V~5.5V
- Number of I/O :
- 8
- Datasheets
- MCP25025T-I/SL
[I/O Expanders Microchip Technology MCP25025T-I/SL] Overview
Introducing the MCP25025T-I/SL from Microchip Technology, an innovative IC I/O expander designed to elevate your electronic circuit designs to new heights of efficiency and functionality. This sophisticated device seamlessly integrates into your circuitry, providing unparalleled expansion capabilities with its 8-bit CAN interface. Crafted with precision engineering, the MCP25025T-I/SL empowers your designs with enhanced connectivity and control, offering a comprehensive solution for a diverse range of applications.
MCP25025T-I/SL Features
- 8-bit CAN interface
- Compact 14SOIC package
- Efficient I/O expansion
- Highly reliable Microchip Technology construction
- Seamless integration into existing circuits
- Enhanced connectivity and control
- Robust performance in varied operating conditions
MCP25025T-I/SL Applications
- Automotive Electronics: The MCP25025T-I/SL facilitates seamless integration of additional I/O capabilities in automotive control systems, enabling precise monitoring and control of critical vehicle functions such as engine management and transmission control.
- Industrial Automation: Leveraging the MCP25025T-I/SL, industrial automation systems can achieve enhanced connectivity and scalability, enabling efficient control and monitoring of manufacturing processes, robotics, and equipment.
- Home Automation: In home automation systems, the MCP25025T-I/SL empowers designers to expand I/O capabilities, facilitating seamless integration of various smart home devices and enabling centralized control and monitoring for enhanced convenience and energy efficiency.
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