MCP2025-330E/MD
- Mfr.Part #
- MCP2025-330E/MD
- Manufacturer
- Microchip Technology
- Package / Case
- 8-VDFN Exposed Pad
- Datasheet
- Download
- Description
- IC TRANSCEIVER HALF 1/1 8DFN
- Stock
- 198
- In Stock :
- 198
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- Manufacturer :
- Microchip Technology
- Product Category :
- Drivers, Receivers, Transceivers
- Mounting :
- Surface Mount
- Terminal Pitch :
- 0.8 mm
- Base Part Number :
- MCP2025
- Weight :
- 37.393021mg
- Package / Case :
- 8-VDFN Exposed Pad
- Product Type :
- LIN Transceivers
- Number of Drivers/Receivers :
- 1/1
- Terminal Finish :
- Matte Tin (Sn) - annealed
- Telecom IC Type :
- ETHERNET TRANSCEIVER
- Terminal Position :
- Dual
- Operating Temperature :
- -40°C~125°C
- Supply Voltage :
- 12V
- Number of Pins :
- 8
- Data Rate :
- 20 kbps
- Product Status :
- Active
- Minimum Operating Temperature :
- - 40 C
- Length :
- 4mm
- Reach Compliance Code :
- Compliant
- Terminal Form :
- NO LEAD
- Manufacturer :
- Microchip
- Factory Lead Time :
- 23 Weeks
- Type :
- Transceiver
- Package :
- Tube
- JESD-30 Code :
- S-PDSO-N8
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- RoHS :
- Details
- Maximum Data Rate :
- 20 kbps
- Surface Mount :
- yes
- Width :
- 4mm
- Operating Supply Current :
- 200μA
- Duplex :
- Half
- Mounting Type :
- Surface Mount
- Protocol :
- LINbus
- Package Shape :
- Square
- Supplier Device Package :
- 8-DFN (4x4)
- HTS Code :
- 8542.39.00.01
- Base Product Number :
- MCP2025
- Operating Supply Voltage :
- 12, 2 V
- Product :
- LIN Transceivers
- Number of Terminals :
- 8
- Temperature Grade :
- Automotive
- Number of Functions :
- 1
- Maximum Operating Temperature :
- + 125 C
- RoHS Status :
- ROHS3 Compliant
- Pin Count :
- 8
- Packaging :
- Tube
- Peak Reflow Temperature (Cel) :
- 260
- Voltage - Supply :
- 6V~18V
- Number of Transmitters :
- 1
- Product Category :
- LIN Transceivers
- JESD-609 Code :
- e3
- Supplier Package :
- DFN
- Subcategory :
- Interface ICs
- Screening Level :
- Extended Industrial
- Series :
- --
- Seated Height-Max :
- 1 mm
- Receiver Hysteresis :
- 175mV
- Protocols Supported :
- ISO 7637
- Published :
- 2012
- Max Supply Current :
- 1mA
- Brand :
- Microchip Technology
- Mounting Style :
- SMD/SMT
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Datasheets
- MCP2025-330E/MD

Drivers, Receivers, Transceivers Microchip Technology MCP2025-330E/MD Overview
Introducing the MCP2025-330E/MD, a cutting-edge integrated circuit transceiver meticulously crafted by Microchip Technology. This marvel of engineering represents the pinnacle of performance and reliability in the realm of drivers, receivers, and transceivers. Engineered with precision and built to exacting standards, this transceiver half offers unparalleled functionality and versatility, making it the ideal choice for a wide range of applications.
With its compact 8DFN package, the MCP2025-330E/MD seamlessly integrates into diverse electronic systems, delivering seamless communication and robust signal transmission. Whether deployed in automotive, industrial, or consumer electronics, this transceiver empowers your devices with exceptional connectivity and efficiency, ensuring seamless operation and enhanced performance.
MCP2025-330E/MD Features
- Highly integrated half transceiver
- Compact 8DFN package for space-constrained applications
- Precision-engineered for reliability and durability
- Wide operating voltage range for versatile deployment
- Robust communication protocol support
- Efficient power management capabilities
MCP2025-330E/MD Applications
- Automotive Systems: The MCP2025-330E/MD facilitates seamless communication between various automotive control modules, ensuring efficient vehicle operation and enhanced safety features.
- Industrial Automation: Deployed in industrial automation systems, this transceiver enables reliable data exchange between sensors, actuators, and control units, optimizing production processes and increasing operational efficiency.
- Consumer Electronics: From smart home devices to wearable technology, the MCP2025-330E/MD enhances connectivity and communication capabilities, enabling seamless interaction between devices for a more integrated user experience.
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