MCP2022PT-330E/SL

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Mfr.Part #
MCP2022PT-330E/SL
Manufacturer
Microchip Technology
Package / Case
14-SOIC (0.154, 3.90mm Width)
Datasheet
Download
Description
IC TRANSCEIVER HALF 1/1 14SOIC
Stock
40,560
In Stock :
40,560

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Manufacturer :
Microchip Technology
Product Category :
Drivers, Receivers, Transceivers
Number of Drivers/Receivers :
1/1
Receiver Hysteresis :
175mV
Duplex :
Half
Operating Supply Current :
115μA
Package / Case :
14-SOIC (0.154, 3.90mm Width)
Package :
Tape and Reel (TR)
RoHS Status :
ROHS3 Compliant
Manufacturer :
Microchip Technology Inc
Time@Peak Reflow Temperature-Max (s) :
40
Base Product Number :
MCP2022
Reach Compliance Code :
Compliant
Base Part Number :
MCP2022
Mounting Type :
Surface Mount
Terminal Finish :
Matte Tin (Sn) - annealed
Published :
2012
Telecom IC Type :
INTERFACE CIRCUIT
Peak Reflow Temperature (Cel) :
260
Product Status :
Active
Packaging :
Tape and Reel (TR)
Protocol :
LINbus
Voltage - Supply :
6V~18V
Supplier Device Package :
14-SOIC
Series :
--
Data Rate :
--
Weight :
338.011364mg
Operating Temperature :
-40°C~125°C
JESD-609 Code :
e3
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Type :
Transceiver
Factory Lead Time :
17 Weeks
Operating Supply Voltage :
18V
Datasheets
MCP2022PT-330E/SL
Introducing Drivers, Receivers, Transceivers Microchip Technology MCP2022PT-330E/SL from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:14-SOIC (0.154, 3.90mm Width), Base Part Number:MCP2022, Mounting Type:Surface Mount, Operating Temperature:-40°C~125°C, Type:Transceiver, MCP2022PT-330E/SL pinout, MCP2022PT-330E/SL datasheet PDF, MCP2022PT-330E/SL amp .Beyond Drivers, Receivers, Transceivers Microchip Technology MCP2022PT-330E/SL ,we also offer SP3232EBCN-L/TR, MAX202IDR, THVD1400DR, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology MCP2022PT-330E/SL


Drivers, Receivers, Transceivers Microchip Technology MCP2022PT-330E/SL Overview

Introducing the MCP2022PT-330E/SL from Microchip Technology, a top-of-the-line half-duplex transceiver designed for robust and reliable communication in automotive and industrial applications. This transceiver integrates effectively within multiple systems, offering excellent immunity to electromagnetic interference and minimal external components requirement. This makes it an ideal choice for developers looking to streamline their designs while maintaining high reliability in harsh environments. The inclusion of the Drivers, Receivers, Transceivers Microchip Technology MCP2022PT-330E/SL in your designs ensures compliance with stringent industry standards, enhancing system reliability and operational efficiency.

MCP2022PT-330E/SL Features

The MCP2022PT-330E/SL transceiver is packed with features designed for efficient and secure data transmission. Key features include:

  • Half-duplex communication capability, allowing for bidirectional communication on a single line.
  • High-speed data rates up to 20 Kbps, ensuring quick and reliable data transmission.
  • Enhanced Electrostatic Discharge (ESD) protection, safeguarding the device from sudden electrical spikes.
  • Wide operating voltage range (4.5V to 5.5V), accommodating various power supplies.
  • Thermal shutdown protection, which prevents damage from overheating.
  • Low-power consumption mode, promoting energy efficiency in end applications.

MCP2022PT-330E/SL Applications

  • Automotive Networks: Utilized in vehicle bus systems to enable reliable communication between microcontrollers and devices under rigorous conditions.
  • Industrial Automation: Employs robust data handling capabilities to facilitate machine-to-machine communication in factories and plants.
  • Building Automation: Ensures smooth and efficient operation of HVAC and lighting systems through stable data transmissions.
  • Consumer Electronics: Integrated in home automation systems for enhanced connectivity and control over household devices.
  • Telecommunication Equipment: Provides the backbone for data exchange in communication infrastructure, enhancing connectivity reliability.
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