MCP2022-330E/ST
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- Mfr.Part #
- MCP2022-330E/ST
- Manufacturer
- Microchip Technology
- Package / Case
- 14-TSSOP (0.173, 4.40mm Width)
- Datasheet
- Download
- Description
- IC TRANSCEIVER HALF 1/1 14TSSOP
- Stock
- 6,635
- In Stock ：
- 6,635
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- Manufacturer :
- Microchip Technology
- Product Category :
- Drivers, Receivers, Transceivers
- Package Shape :
- RECTANGULAR
- Length :
- 5mm
- Peak Reflow Temperature (Cel) :
- 260
- Voltage - Supply :
- 6V~18V
- Mounting Type :
- Surface Mount
- Reach Compliance Code :
- Compliant
- Number of Functions :
- 1
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Data Rate :
- --
- Factory Lead Time :
- 7 Weeks
- Maximum Data Rate :
- 20 KBd
- RoHS Status :
- ROHS3 Compliant
- Manufacturer :
- Microchip
- Mounting :
- Surface Mount
- Number of Terminals :
- 14
- Package :
- Tube
- Supplier Package :
- TSSOP
- Temperature Grade :
- Automotive
- ECCN Code :
- EAR99
- Supplier Device Package :
- 14-TSSOP
- Protocol :
- LINbus
- Seated Height-Max :
- 1.2 mm
- Terminal Finish :
- Matte Tin (Sn) - annealed
- Number of Drivers/Receivers :
- 1/1
- Operating Supply Current :
- 1mA
- HTS Code :
- 8542.39.00.01
- Telecom IC Type :
- INTERFACE CIRCUIT
- Supply Voltage :
- 12V
- Width :
- 4.4mm
- Base Product Number :
- MCP2022
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Mount :
- Surface Mount
- JESD-30 Code :
- R-PDSO-G14
- Product Type :
- LIN Transceivers
- Receiver Hysteresis :
- 175mV
- Pin Count :
- 14
- JESD-609 Code :
- e3
- Nominal Supply Current :
- 1mA
- Brand :
- Microchip Technology
- Number of Terminations :
- 14
- Operating Temperature :
- -40°C~125°C
- Published :
- 2009
- Operating Supply Voltage :
- 5 V
- Terminal Pitch :
- 0.65mm
- Duplex :
- Half
- Supply Type :
- Single
- Terminal Position :
- Dual
- Number of Receivers :
- 1
- Number of Transmitters :
- 1
- Terminal Form :
- Gull wing
- Weight :
- 140.30179mg
- Power Supply Type :
- Single
- Minimum Operating Temperature :
- - 40 C
- Product Category :
- LIN Transceivers
- Series :
- --
- Surface Mount :
- yes
- Mounting Style :
- SMD/SMT
- Base Part Number :
- MCP2022
- Package / Case :
- 14-TSSOP (0.173, 4.40mm Width)
- Number of Pins :
- 14
- RoHS :
- Details
- Maximum Operating Temperature :
- + 125 C
- Max Supply Current :
- 1mA
- Type :
- Transceiver
- Product Status :
- Active
- Subcategory :
- Interface ICs
- Packaging :
- Tube
- Product :
- LIN Transceivers
- Datasheets
- MCP2022-330E/ST
Drivers, Receivers, Transceivers Microchip Technology MCP2022-330E/ST Overview
The MCP2022-330E/ST by Microchip Technology is a specialized transceiver component designed for reliable half-duplex communication in automotive and industrial applications. This device is encapsulated in a compact 14-TSSOP package, making it ideal for systems where space is at a premium yet robust data transmission is required. As part of the broader Drivers, Receivers, Transceivers category, this IC excels in environments demanding high electromagnetic interference (EMI) protection and low power consumption. The Drivers, Receivers, Transceivers Microchip Technology MCP2022-330E/ST offers a blend of performance and reliability, tailored for developers focusing on efficiency and long-term durability.
MCP2022-330E/ST Features
The MCP2022-330E/ST includes various features that make it a reliable choice for demanding applications. These features include:
- Integrated power-on reset and voltage brown-out protection
- Thermal shutdown and short-circuit protection
- Low-current standby mode for power efficiency
- Up to 20kbps data rate under full-load conditions
- Designed to withstand the harsh environments of automotive and industrial fields
MCP2022-330E/ST Applications
- Automotive Systems: Utilized in vehicle bus communication systems to facilitate reliable data exchange between ECUs, sensors, and actuaries.
- Industrial Automation: Deployed in factory communication networks to ensure robust and error-free data transmission under noisy industrial conditions.
- Building Automation: Helps in the integration of security, HVAC, and lighting systems within buildings to achieve a smarter, more energy-efficient environment.
- Consumer Electronics: Used in devices requiring a reliable communication interface under variable power and environmental conditions.
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