MCP2022-330E/SL
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- Mfr.Part #
- MCP2022-330E/SL
- Manufacturer
- Microchip Technology
- Package / Case
- 14-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- IC TRANSCEIVER HALF 1/1 14SOIC
- Stock
- 6
- In Stock ：
- 6
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- * Quantity:
- Manufacturer :
- Microchip Technology
- Product Category :
- Drivers, Receivers, Transceivers
- Number of Drivers/Receivers :
- 1/1
- Duplex :
- Half
- Product Status :
- Active
- Product Type :
- LIN Transceivers
- Number of Terminals :
- 14
- Number of Receivers :
- 1
- Published :
- 2008
- Terminal Form :
- Gull wing
- Reach Compliance Code :
- Compliant
- Supply Voltage :
- 12V
- Operating Supply Current :
- 1mA
- Terminal Pitch :
- 1.27 mm
- RoHS :
- Details
- Supplier Device Package :
- 14-SOIC
- Telecom IC Type :
- INTERFACE CIRCUIT
- JESD-30 Code :
- R-PDSO-G14
- Surface Mount :
- yes
- Power Supply Type :
- Single
- Mounting Type :
- Surface Mount
- Mounting Style :
- SMD/SMT
- Operating Supply Voltage :
- 18, 6 V
- Number of Pins :
- 14
- Width :
- 3.9mm
- Temperature Grade :
- Automotive
- Data Rate :
- 20 kbps
- Package / Case :
- 14-SOIC (0.154, 3.90mm Width)
- Pin Count :
- 14
- Minimum Operating Temperature :
- - 40 C
- ECCN Code :
- EAR99
- Length :
- 8.65mm
- Maximum Data Rate :
- 20 KBd
- Seated Height-Max :
- 1.75 mm
- Weight :
- 240.999296mg
- HTS Code :
- 8542.39.00.01
- Number of Functions :
- 1
- Mounting :
- Surface Mount
- Base Product Number :
- MCP2022
- REACH SVHC :
- No SVHC
- JESD-609 Code :
- e3
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Packaging :
- Tube
- Peak Reflow Temperature (Cel) :
- 260
- Supplier Package :
- SOIC N
- Factory Lead Time :
- 9 Weeks
- Receiver Hysteresis :
- 175mV
- Type :
- Transceiver
- Voltage - Supply :
- 6V~18V
- Terminal Finish :
- Matte Tin (Sn) - annealed
- Package :
- Tube
- Brand :
- Microchip Technology
- Maximum Operating Temperature :
- + 125 C
- RoHS Status :
- ROHS3 Compliant
- Base Part Number :
- MCP2022
- Package Shape :
- RECTANGULAR
- Supply Type :
- Single
- Operating Temperature :
- -40°C~125°C
- Number of Transmitters :
- 1
- Product :
- LIN Transceivers
- Height :
- 1.25mm
- Protocol :
- LINbus
- Subcategory :
- Interface ICs
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Series :
- --
- Terminal Position :
- Dual
- Max Supply Current :
- 1mA
- Manufacturer :
- Microchip
- Mount :
- Surface Mount
- Product Category :
- LIN Transceivers
- Protocols Supported :
- LIN 1.3/LIN 2.0/LIN 2.1/SAE J2602
- Datasheets
- MCP2022-330E/SL
Drivers, Receivers, Transceivers Microchip Technology MCP2022-330E/SL Overview
The MCP2022-330E/SL by Microchip Technology stands out in the market of Drivers, Receivers, and Transceivers, offering robust solutions for communication applications. This integrated circuit (IC) transceiver facilitates reliable half-duplex communication, making it an essential component in systems requiring serial data exchange over a single signal path. With its compact 14SOIC package, it ensures a minimal footprint while maximizing performance, a crucial factor for modern electronic designs. This product is especially designed to meet the stringent requirements of automotive and industrial communication systems, blending high functionality with operational simplicity.
MCP2022-330E/SL Features
This IC transceiver incorporates several key features that enhance its performance and usability in demanding applications. It supports a single driver and receiver configuration, providing efficient half-duplex communication. The device operates over a broad temperature range, making it suitable for harsh environments. Additionally, its low-power consumption and ESD protection ensure reliable operation and durability in various application settings.
MCP2022-330E/SL Applications
- Automotive Systems: Utilized in vehicle communication networks to facilitate data exchange between electronic control units (ECUs).
- Industrial Automation: Helps in robust data communication in factory settings, particularly in automation and process control systems.
- Telecommunications Equipment: Acts as a foundational component in telecom devices for reliable data transmission.
- Consumer Electronics: Implemented in devices requiring efficient and compact communication capabilities.
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