MCP2003BT-E/MF
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- Mfr.Part #
- MCP2003BT-E/MF
- Manufacturer
- Microchip Technology
- Package / Case
- 8-VDFN Exposed Pad
- Datasheet
- Download
- Description
- IC TRANSCEIVER HALF 1/1 8DFN
- Stock
- 2,597
- In Stock ：
- 2,597
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- Manufacturer :
- Microchip Technology
- Product Category :
- Drivers, Receivers, Transceivers
- Driver Number of Bits :
- 1
- Mounting Type :
- Surface Mount
- Interface IC Type :
- LINE TRANSCEIVER
- RoHS Status :
- ROHS3 Compliant
- Power Supply Type :
- Single
- Operating Supply Voltage :
- 5.5, 30 V
- Factory Lead Time :
- 8 Weeks
- Subcategory :
- Interface ICs
- Package :
- Tape and Reel (TR)
- Operating Temperature :
- -40°C~125°C
- Product Status :
- Active
- Length :
- 3mm
- Package / Case :
- 8-VDFN Exposed Pad
- Base Part Number :
- MCP2003
- Receiver Number of Bits :
- 1
- Pin Count :
- 8
- Voltage - Supply :
- 5.5V~30V
- Input Characteristics :
- Schmitt Trigger
- Duplex :
- Half
- Number of Terminations :
- 8
- Supplier Package :
- DFN
- Manufacturer :
- Microchip
- Terminal Pitch :
- 0.65mm
- Mount :
- Surface Mount
- Product Category :
- LIN Transceivers
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Number of Functions :
- 1
- Supply Voltage :
- 12V
- Transmit Delay-Max :
- 4000 ns
- Terminal Form :
- NO LEAD
- Height Seated (Max) :
- 1mm
- Width :
- 3mm
- JESD-30 Code :
- S-PDSO-N8
- Protocol :
- LINbus
- ECCN Code :
- EAR99
- Differential Output :
- No
- HTS Code :
- 8542.39.00.01
- Protocols Supported :
- SO 17987/SAE J2602
- Number of Terminals :
- 8
- Number of Drivers/Receivers :
- 1/1
- Supplier Device Package :
- 8-DFN (3x3)
- Receive Delay-Max :
- 6000 ns
- Packaging :
- Tape and Reel (TR)
- Terminal Finish :
- Matte Tin (Sn) - annealed
- Number of Transmitters :
- 1
- Data Rate :
- 20kBaud
- Surface Mount :
- yes
- JESD-609 Code :
- e3
- Package Shape :
- Square
- Seated Height-Max :
- 1 mm
- Number of Receivers :
- 1
- Brand :
- Microchip Technology
- Temperature Grade :
- Automotive
- Terminal Position :
- Dual
- Series :
- --
- Type :
- Transceiver
- Base Product Number :
- MCP2003
- RoHS :
- Details
- Published :
- 2016
- Screening Level :
- TS 16949
- Product Type :
- LIN Transceivers
- Interface Standard :
- ISO 17987; ISO 7637
- Reach Compliance Code :
- Compliant
- Mounting :
- Surface Mount
- Simplex/Duplex :
- Half Duplex
- Maximum Data Rate :
- 20 KBd
- Operating Supply Current :
- 160 uA
- Datasheets
- MCP2003BT-E/MF
MCP2003BT-E/MF Documents
Drivers, Receivers, Transceivers Microchip Technology MCP2003BT-E/MF Overview
The MCP2003BT-E/MF from Microchip Technology is a robust and versatile half-duplex transceiver designed for LIN bus applications within the automotive sector. This compact component in an 8-pin DFN package is engineered to facilitate reliable communication in networks requiring high electromagnetic compatibility (EMC) and electrostatic discharge (ESD) protection. The integration of this IC in your systems ensures reduced external component count while boosting overall reliability and performance. It's ideal for designers looking to enhance automotive communication systems with a component that offers both high durability and exceptional functionality.
MCP2003BT-E/MF Features
This transceiver boasts several key features that make it suitable for demanding applications. It includes a robust ESD protection system, capable of withstanding up to ±15kV on the bus pins, ensuring reliability in harsh environments. The device operates over a broad temperature range of -40°C to +125°C, making it suitable for automotive applications. Additionally, it supports a maximum baud rate of 20kbps, which is typical for LIN bus communication protocols. The MCP2003BT-E/MF also includes a power-saving sleep mode, further enhancing its efficiency in vehicle networks.
MCP2003BT-E/MF Applications
- Automotive Networks: Used in LIN bus systems for communication between components like sensors, actuators, and control modules.
- Industrial Automation: Facilitates robust data communication in industrial equipment requiring high levels of noise immunity and reliability.
- Building Automation Systems: Integrates into building management systems for enhanced communication reliability in devices such as HVAC controls and lighting systems.
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