MCP2003BT-E/MF
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- Mfr.Part #
- MCP2003BT-E/MF
- Manufacturer
- Microchip Technology
- Package / Case
- 8-VDFN Exposed Pad
- Datasheet
- Download
- Description
- IC TRANSCEIVER HALF 1/1 8DFN
- Stock
- 2,597
- In Stock ：
- 2,597
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- Manufacturer :
- Microchip Technology
- Product Category :
- Drivers, Receivers, Transceivers
- Reach Compliance Code :
- Compliant
- Length :
- 3mm
- Number of Transmitters :
- 1
- JESD-30 Code :
- S-PDSO-N8
- Terminal Pitch :
- 0.65mm
- HTS Code :
- 8542.39.00.01
- Receive Delay-Max :
- 6000 ns
- Mounting Type :
- Surface Mount
- Receiver Number of Bits :
- 1
- Terminal Finish :
- Matte Tin (Sn) - annealed
- Published :
- 2016
- Series :
- --
- Protocols Supported :
- SO 17987/SAE J2602
- Data Rate :
- 20kBaud
- Differential Output :
- No
- Supply Voltage :
- 12V
- Manufacturer :
- Microchip
- Base Part Number :
- MCP2003
- Interface IC Type :
- LINE TRANSCEIVER
- Power Supply Type :
- Single
- Screening Level :
- TS 16949
- Terminal Form :
- NO LEAD
- Seated Height-Max :
- 1 mm
- Simplex/Duplex :
- Half Duplex
- Operating Supply Current :
- 160 uA
- Number of Terminations :
- 8
- Package Shape :
- Square
- Width :
- 3mm
- Product Category :
- LIN Transceivers
- Mount :
- Surface Mount
- Mounting :
- Surface Mount
- Terminal Position :
- Dual
- Number of Drivers/Receivers :
- 1/1
- Interface Standard :
- ISO 17987; ISO 7637
- Brand :
- Microchip Technology
- JESD-609 Code :
- e3
- Protocol :
- LINbus
- Height Seated (Max) :
- 1mm
- Supplier Package :
- DFN
- Transmit Delay-Max :
- 4000 ns
- RoHS Status :
- ROHS3 Compliant
- Product Status :
- Active
- Base Product Number :
- MCP2003
- Operating Supply Voltage :
- 5.5, 30 V
- Voltage - Supply :
- 5.5V~30V
- Input Characteristics :
- Schmitt Trigger
- Packaging :
- Tape and Reel (TR)
- Number of Terminals :
- 8
- Duplex :
- Half
- Pin Count :
- 8
- ECCN Code :
- EAR99
- Package / Case :
- 8-VDFN Exposed Pad
- Subcategory :
- Interface ICs
- Driver Number of Bits :
- 1
- Factory Lead Time :
- 8 Weeks
- Package :
- Tape and Reel (TR)
- Number of Receivers :
- 1
- Number of Functions :
- 1
- Operating Temperature :
- -40°C~125°C
- Type :
- Transceiver
- Surface Mount :
- yes
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- RoHS :
- Details
- Maximum Data Rate :
- 20 KBd
- Temperature Grade :
- Automotive
- Supplier Device Package :
- 8-DFN (3x3)
- Product Type :
- LIN Transceivers
- Datasheets
- MCP2003BT-E/MF
MCP2003BT-E/MF Documents
Drivers, Receivers, Transceivers Microchip Technology MCP2003BT-E/MF Overview
The MCP2003BT-E/MF from Microchip Technology is a robust and versatile half-duplex transceiver designed for LIN bus applications within the automotive sector. This compact component in an 8-pin DFN package is engineered to facilitate reliable communication in networks requiring high electromagnetic compatibility (EMC) and electrostatic discharge (ESD) protection. The integration of this IC in your systems ensures reduced external component count while boosting overall reliability and performance. It's ideal for designers looking to enhance automotive communication systems with a component that offers both high durability and exceptional functionality.
MCP2003BT-E/MF Features
This transceiver boasts several key features that make it suitable for demanding applications. It includes a robust ESD protection system, capable of withstanding up to ±15kV on the bus pins, ensuring reliability in harsh environments. The device operates over a broad temperature range of -40°C to +125°C, making it suitable for automotive applications. Additionally, it supports a maximum baud rate of 20kbps, which is typical for LIN bus communication protocols. The MCP2003BT-E/MF also includes a power-saving sleep mode, further enhancing its efficiency in vehicle networks.
MCP2003BT-E/MF Applications
- Automotive Networks: Used in LIN bus systems for communication between components like sensors, actuators, and control modules.
- Industrial Automation: Facilitates robust data communication in industrial equipment requiring high levels of noise immunity and reliability.
- Building Automation Systems: Integrates into building management systems for enhanced communication reliability in devices such as HVAC controls and lighting systems.
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