MCP2003BT-E/MF
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- Mfr.Part #
- MCP2003BT-E/MF
- Manufacturer
- Microchip Technology
- Package / Case
- 8-VDFN Exposed Pad
- Datasheet
- Download
- Description
- IC TRANSCEIVER HALF 1/1 8DFN
- Stock
- 2,597
- In Stock ：
- 2,597
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- Manufacturer :
- Microchip Technology
- Product Category :
- Drivers, Receivers, Transceivers
- Subcategory :
- Interface ICs
- Operating Supply Voltage :
- 5.5, 30 V
- Mounting Type :
- Surface Mount
- Receive Delay-Max :
- 6000 ns
- Maximum Data Rate :
- 20 KBd
- Simplex/Duplex :
- Half Duplex
- JESD-609 Code :
- e3
- Number of Terminals :
- 8
- Product Status :
- Active
- Product Category :
- LIN Transceivers
- Number of Transmitters :
- 1
- Number of Terminations :
- 8
- Receiver Number of Bits :
- 1
- Supplier Device Package :
- 8-DFN (3x3)
- Protocol :
- LINbus
- Pin Count :
- 8
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Operating Supply Current :
- 160 uA
- Driver Number of Bits :
- 1
- Number of Receivers :
- 1
- Operating Temperature :
- -40°C~125°C
- Interface IC Type :
- LINE TRANSCEIVER
- Seated Height-Max :
- 1 mm
- Interface Standard :
- ISO 17987; ISO 7637
- Screening Level :
- TS 16949
- Terminal Position :
- Dual
- Protocols Supported :
- SO 17987/SAE J2602
- Number of Drivers/Receivers :
- 1/1
- Number of Functions :
- 1
- RoHS Status :
- ROHS3 Compliant
- Supply Voltage :
- 12V
- Mounting :
- Surface Mount
- RoHS :
- Details
- Mount :
- Surface Mount
- Package Shape :
- Square
- Input Characteristics :
- Schmitt Trigger
- Reach Compliance Code :
- Compliant
- Terminal Form :
- NO LEAD
- Brand :
- Microchip Technology
- Length :
- 3mm
- Temperature Grade :
- Automotive
- Terminal Finish :
- Matte Tin (Sn) - annealed
- ECCN Code :
- EAR99
- Product Type :
- LIN Transceivers
- Base Product Number :
- MCP2003
- Width :
- 3mm
- Voltage - Supply :
- 5.5V~30V
- Differential Output :
- No
- Supplier Package :
- DFN
- Packaging :
- Tape and Reel (TR)
- Surface Mount :
- yes
- Terminal Pitch :
- 0.65mm
- Duplex :
- Half
- Transmit Delay-Max :
- 4000 ns
- JESD-30 Code :
- S-PDSO-N8
- Package :
- Tape and Reel (TR)
- Package / Case :
- 8-VDFN Exposed Pad
- Factory Lead Time :
- 8 Weeks
- HTS Code :
- 8542.39.00.01
- Height Seated (Max) :
- 1mm
- Base Part Number :
- MCP2003
- Data Rate :
- 20kBaud
- Published :
- 2016
- Series :
- --
- Power Supply Type :
- Single
- Type :
- Transceiver
- Manufacturer :
- Microchip
- Datasheets
- MCP2003BT-E/MF
Drivers, Receivers, Transceivers Microchip Technology MCP2003BT-E/MF Overview
The MCP2003BT-E/MF from Microchip Technology is a robust and versatile half-duplex transceiver designed for LIN bus applications within the automotive sector. This compact component in an 8-pin DFN package is engineered to facilitate reliable communication in networks requiring high electromagnetic compatibility (EMC) and electrostatic discharge (ESD) protection. The integration of this IC in your systems ensures reduced external component count while boosting overall reliability and performance. It's ideal for designers looking to enhance automotive communication systems with a component that offers both high durability and exceptional functionality.
MCP2003BT-E/MF Features
This transceiver boasts several key features that make it suitable for demanding applications. It includes a robust ESD protection system, capable of withstanding up to ±15kV on the bus pins, ensuring reliability in harsh environments. The device operates over a broad temperature range of -40°C to +125°C, making it suitable for automotive applications. Additionally, it supports a maximum baud rate of 20kbps, which is typical for LIN bus communication protocols. The MCP2003BT-E/MF also includes a power-saving sleep mode, further enhancing its efficiency in vehicle networks.
MCP2003BT-E/MF Applications
- Automotive Networks: Used in LIN bus systems for communication between components like sensors, actuators, and control modules.
- Industrial Automation: Facilitates robust data communication in industrial equipment requiring high levels of noise immunity and reliability.
- Building Automation Systems: Integrates into building management systems for enhanced communication reliability in devices such as HVAC controls and lighting systems.
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