MCP2003BT-E/MF
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- Mfr.Part #
- MCP2003BT-E/MF
- Manufacturer
- Microchip Technology
- Package / Case
- 8-VDFN Exposed Pad
- Datasheet
- Download
- Description
- IC TRANSCEIVER HALF 1/1 8DFN
- Stock
- 2,597
- In Stock ：
- 2,597
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- Manufacturer :
- Microchip Technology
- Product Category :
- Drivers, Receivers, Transceivers
- Data Rate :
- 20kBaud
- Seated Height-Max :
- 1 mm
- Differential Output :
- No
- RoHS :
- Details
- Number of Receivers :
- 1
- Mounting Type :
- Surface Mount
- Terminal Position :
- Dual
- Base Product Number :
- MCP2003
- Brand :
- Microchip Technology
- Surface Mount :
- yes
- Terminal Finish :
- Matte Tin (Sn) - annealed
- Voltage - Supply :
- 5.5V~30V
- Number of Terminations :
- 8
- Package / Case :
- 8-VDFN Exposed Pad
- Pin Count :
- 8
- Reach Compliance Code :
- Compliant
- Maximum Data Rate :
- 20 KBd
- Product Type :
- LIN Transceivers
- Interface IC Type :
- LINE TRANSCEIVER
- Published :
- 2016
- Mount :
- Surface Mount
- Factory Lead Time :
- 8 Weeks
- Duplex :
- Half
- Power Supply Type :
- Single
- Transmit Delay-Max :
- 4000 ns
- Product Category :
- LIN Transceivers
- Protocols Supported :
- SO 17987/SAE J2602
- JESD-609 Code :
- e3
- Number of Functions :
- 1
- Type :
- Transceiver
- Packaging :
- Tape and Reel (TR)
- JESD-30 Code :
- S-PDSO-N8
- Protocol :
- LINbus
- Operating Supply Voltage :
- 5.5, 30 V
- Supplier Device Package :
- 8-DFN (3x3)
- Receiver Number of Bits :
- 1
- Number of Terminals :
- 8
- Operating Supply Current :
- 160 uA
- Input Characteristics :
- Schmitt Trigger
- Terminal Pitch :
- 0.65mm
- Temperature Grade :
- Automotive
- Length :
- 3mm
- Operating Temperature :
- -40°C~125°C
- Simplex/Duplex :
- Half Duplex
- Package Shape :
- Square
- RoHS Status :
- ROHS3 Compliant
- ECCN Code :
- EAR99
- Subcategory :
- Interface ICs
- Base Part Number :
- MCP2003
- Supplier Package :
- DFN
- Width :
- 3mm
- Number of Transmitters :
- 1
- Supply Voltage :
- 12V
- Receive Delay-Max :
- 6000 ns
- Screening Level :
- TS 16949
- Interface Standard :
- ISO 17987; ISO 7637
- Package :
- Tape and Reel (TR)
- Height Seated (Max) :
- 1mm
- Manufacturer :
- Microchip
- Number of Drivers/Receivers :
- 1/1
- Series :
- --
- Mounting :
- Surface Mount
- Driver Number of Bits :
- 1
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- HTS Code :
- 8542.39.00.01
- Product Status :
- Active
- Terminal Form :
- NO LEAD
- Datasheets
- MCP2003BT-E/MF
Drivers, Receivers, Transceivers Microchip Technology MCP2003BT-E/MF Overview
The MCP2003BT-E/MF from Microchip Technology is a robust and versatile half-duplex transceiver designed for LIN bus applications within the automotive sector. This compact component in an 8-pin DFN package is engineered to facilitate reliable communication in networks requiring high electromagnetic compatibility (EMC) and electrostatic discharge (ESD) protection. The integration of this IC in your systems ensures reduced external component count while boosting overall reliability and performance. It's ideal for designers looking to enhance automotive communication systems with a component that offers both high durability and exceptional functionality.
MCP2003BT-E/MF Features
This transceiver boasts several key features that make it suitable for demanding applications. It includes a robust ESD protection system, capable of withstanding up to ±15kV on the bus pins, ensuring reliability in harsh environments. The device operates over a broad temperature range of -40°C to +125°C, making it suitable for automotive applications. Additionally, it supports a maximum baud rate of 20kbps, which is typical for LIN bus communication protocols. The MCP2003BT-E/MF also includes a power-saving sleep mode, further enhancing its efficiency in vehicle networks.
MCP2003BT-E/MF Applications
- Automotive Networks: Used in LIN bus systems for communication between components like sensors, actuators, and control modules.
- Industrial Automation: Facilitates robust data communication in industrial equipment requiring high levels of noise immunity and reliability.
- Building Automation Systems: Integrates into building management systems for enhanced communication reliability in devices such as HVAC controls and lighting systems.
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