MCIMX6X3CVN08AB

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Number of Terminations :

400

Series :

i.MX6SX

Package / Case :

400-LFBGA

Low Power Mode :

yes

Supply Voltage-Min (Vsup) :

1.275V

Terminal Position :

BOTTOM

JESD-609 Code :

e1

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Core Processor :

ARM® Cortex®-A9, ARM® Cortex®-M4

Terminal Pitch :

0.8mm

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Number of Cores/Bus Width :

2 Core 32-Bit

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Boundary Scan :

yes

Additional Interfaces :

AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART

Security Features :

A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE

Packaging :

Tray

Integrated Cache :

yes

Address Bus Width :

15

Surface Mount :

yes

Format :

Floating Point

JESD-30 Code :

S-PBGA-B400

USB :

USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)

External Data Bus Width :

32

Operating Temperature :

-40°C~105°C TA

Voltage - I/O :

1.8V 2.5V 2.8V 3.15V

Graphics Acceleration :

yes

Time@Peak Reflow Temperature-Max (s) :

40

Ethernet :

10/100/1000Mbps (2)

Height Seated (Max) :

1.53mm

Display & Interface Controllers :

Keypad, LCD

HTS Code :

8542.31.00.01

Speed :

200MHz, 800MHz

ECCN Code :

5A992

RoHS Status :

ROHS3 Compliant

RAM Controllers :

LPDDR2, LVDDR3, DDR3

Supply Voltage-Max (Vsup) :

1.5V

Length :

17mm

Published :

2002

Peak Reflow Temperature (Cel) :

260

Factory Lead Time :

15 Weeks

Co-Processors/DSP :

Multimedia; NEON™ MPE

Terminal Form :

Ball