MCIMX6U5EVM10ACR

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Voltage - I/O :

1.8V 2.5V 2.8V 3.3V

Clock Frequency :

24MHz

RAM Controllers :

LPDDR2, LVDDR3, DDR3

Published :

2011

JESD-30 Code :

S-PBGA-B624

Series :

i.MX6DL

Height Seated (Max) :

1.5mm

Terminal Form :

Ball

Terminal Pitch :

0.8mm

Display & Interface Controllers :

Keypad, LCD

Core Processor :

ARM® Cortex®-A9

Operating Temperature :

-20°C~105°C TJ

Terminal Finish :

TIN SILVER COPPER

Co-Processors/DSP :

Multimedia; NEON™ SIMD

Format :

Floating Point

Packaging :

Tape and Reel (TR)

Package / Case :

624-LFBGA

Surface Mount :

yes

Address Bus Width :

16

Graphics Acceleration :

yes

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Bit Size :

32

Number of Terminations :

624

JESD-609 Code :

e1

Number of Cores/Bus Width :

2 Core 32-Bit

Peak Reflow Temperature (Cel) :

260

Speed :

1.0GHz

Factory Lead Time :

15 Weeks

Terminal Position :

BOTTOM

HTS Code :

8542.31.00.01

RoHS Status :

ROHS3 Compliant

Integrated Cache :

yes

Time@Peak Reflow Temperature-Max (s) :

40

Additional Interfaces :

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Length :

21mm

USB :

USB 2.0 + PHY (4)

Security Features :

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Low Power Mode :

yes

Ethernet :

10/100/1000Mbps (1)

Boundary Scan :

yes

ECCN Code :

5A992

External Data Bus Width :

64