MCIMX6U5DVM10AC

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Factory Lead Time :

15 Weeks

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Package / Case :

624-LFBGA

Boundary Scan :

yes

Packaging :

Tray

Low Power Mode :

yes

RoHS Status :

ROHS3 Compliant

Surface Mount :

yes

Security Features :

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Core Processor :

ARM® Cortex®-A9

Supply Voltage-Max (Vsup) :

1.5V

JESD-609 Code :

e1

Terminal Position :

BOTTOM

Graphics Acceleration :

yes

Height Seated (Max) :

1.6mm

Supply Voltage-Min (Vsup) :

1.35V

Voltage - I/O :

1.8V 2.5V 2.8V 3.3V

Ethernet :

10/100/1000Mbps (1)

Number of Terminations :

624

Integrated Cache :

yes

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Speed :

1.0GHz

RAM Controllers :

LPDDR2, LVDDR3, DDR3

Series :

i.MX6DL

Time@Peak Reflow Temperature-Max (s) :

40

Address Bus Width :

26

Format :

FIXED POINT

Terminal Form :

Ball

JESD-30 Code :

S-PBGA-B624

USB :

USB 2.0 + PHY (4)

Number of Cores/Bus Width :

2 Core 32-Bit

Length :

21mm

Operating Temperature :

0°C~95°C TJ

Display & Interface Controllers :

Keypad, LCD

Additional Interfaces :

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Peak Reflow Temperature (Cel) :

260

External Data Bus Width :

64

Terminal Pitch :

0.8mm

Co-Processors/DSP :

Multimedia; NEON™ SIMD

Published :

2002