MCIMX6S8DVM10AD

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Surface Mount :

yes

Boundary Scan :

yes

RoHS Status :

ROHS3 Compliant

Packaging :

Tray

Additional Interfaces :

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

External Data Bus Width :

32

USB :

USB 2.0 + PHY (4)

RAM (words) :

144K

HTS Code :

8542.39.00.01

Graphics Acceleration :

yes

Supply Voltage-Min (Vsup) :

1.35V

Address Bus Width :

26

Number of Terminations :

624

Length :

21mm

RAM Controllers :

LPDDR2, LVDDR3, DDR3

Package / Case :

624-LFBGA

Display & Interface Controllers :

Keypad, LCD

JESD-30 Code :

S-PBGA-B624

Number of Cores/Bus Width :

1 Core 32-Bit

Number of I/O :

14

Bus Compatibility :

CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB

Core Processor :

ARM® Cortex®-A9

Peak Reflow Temperature (Cel) :

260

Height Seated (Max) :

1.6mm

Terminal Form :

Ball

Ethernet :

10/100/1000Mbps (1)

Voltage - I/O :

1.8V 2.5V 2.8V 3.3V

Series :

i.MX6S

Speed :

1.0GHz

Co-Processors/DSP :

Multimedia; NEON™ SIMD

Terminal Position :

BOTTOM

Operating Temperature :

0°C~95°C TJ

Terminal Pitch :

0.8mm

Security Features :

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Supply Voltage-Max (Vsup) :

1.5V

Time@Peak Reflow Temperature-Max (s) :

40

Factory Lead Time :

15 Weeks