MCIMX6S8DVM10AD

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

USB :

USB 2.0 + PHY (4)

Terminal Pitch :

0.8mm

Terminal Form :

Ball

Length :

21mm

Factory Lead Time :

15 Weeks

RAM (words) :

144K

Terminal Position :

BOTTOM

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Security Features :

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Voltage - I/O :

1.8V 2.5V 2.8V 3.3V

Height Seated (Max) :

1.6mm

Packaging :

Tray

Graphics Acceleration :

yes

Co-Processors/DSP :

Multimedia; NEON™ SIMD

Number of Terminations :

624

Series :

i.MX6S

Package / Case :

624-LFBGA

Number of Cores/Bus Width :

1 Core 32-Bit

Address Bus Width :

26

Supply Voltage-Min (Vsup) :

1.35V

External Data Bus Width :

32

HTS Code :

8542.39.00.01

Operating Temperature :

0°C~95°C TJ

Bus Compatibility :

CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB

Peak Reflow Temperature (Cel) :

260

Display & Interface Controllers :

Keypad, LCD

Core Processor :

ARM® Cortex®-A9

Boundary Scan :

yes

Speed :

1.0GHz

Surface Mount :

yes

Supply Voltage-Max (Vsup) :

1.5V

Ethernet :

10/100/1000Mbps (1)

Additional Interfaces :

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

RAM Controllers :

LPDDR2, LVDDR3, DDR3

Number of I/O :

14

RoHS Status :

ROHS3 Compliant

Time@Peak Reflow Temperature-Max (s) :

40

JESD-30 Code :

S-PBGA-B624