MCIMX6S5DVM10AC

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Ethernet :

10/100/1000Mbps (1)

External Data Bus Width :

32

Boundary Scan :

yes

Graphics Acceleration :

yes

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

RAM Controllers :

LPDDR2, LVDDR3, DDR3

Low Power Mode :

yes

Terminal Position :

BOTTOM

Terminal Form :

Ball

Factory Lead Time :

15 Weeks

Series :

i.MX6S

Core Processor :

ARM® Cortex®-A9

Surface Mount :

yes

Packaging :

Tray

Published :

2002

Security Features :

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Speed :

1.0GHz

Package / Case :

624-LFBGA

Supply Voltage-Max (Vsup) :

1.5V

Format :

FIXED POINT

Peak Reflow Temperature (Cel) :

260

USB :

USB 2.0 + PHY (4)

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Number of Cores/Bus Width :

1 Core 32-Bit

Terminal Pitch :

0.8mm

Supply Voltage-Min (Vsup) :

1.35V

Address Bus Width :

26

Length :

21mm

Voltage - I/O :

1.8V 2.5V 2.8V 3.3V

Display & Interface Controllers :

Keypad, LCD

Additional Interfaces :

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

JESD-30 Code :

S-PBGA-B624

Height Seated (Max) :

1.6mm

Co-Processors/DSP :

Multimedia; NEON™ SIMD

RoHS Status :

ROHS3 Compliant

Number of Terminations :

624

Operating Temperature :

0°C~95°C TJ

Integrated Cache :

yes