MCIMX6S5DVM10AC

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

RAM Controllers :

LPDDR2, LVDDR3, DDR3

Number of Cores/Bus Width :

1 Core 32-Bit

Length :

21mm

RoHS Status :

ROHS3 Compliant

Co-Processors/DSP :

Multimedia; NEON™ SIMD

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

External Data Bus Width :

32

Operating Temperature :

0°C~95°C TJ

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Terminal Pitch :

0.8mm

Number of Terminations :

624

Graphics Acceleration :

yes

Low Power Mode :

yes

JESD-30 Code :

S-PBGA-B624

Format :

FIXED POINT

Peak Reflow Temperature (Cel) :

260

Speed :

1.0GHz

Supply Voltage-Min (Vsup) :

1.35V

Supply Voltage-Max (Vsup) :

1.5V

Height Seated (Max) :

1.6mm

Boundary Scan :

yes

USB :

USB 2.0 + PHY (4)

Published :

2002

Additional Interfaces :

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Surface Mount :

yes

Security Features :

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Series :

i.MX6S

Core Processor :

ARM® Cortex®-A9

Package / Case :

624-LFBGA

Packaging :

Tray

Terminal Form :

Ball

Ethernet :

10/100/1000Mbps (1)

Integrated Cache :

yes

Factory Lead Time :

15 Weeks

Terminal Position :

BOTTOM

Address Bus Width :

26

Voltage - I/O :

1.8V 2.5V 2.8V 3.3V

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Display & Interface Controllers :

Keypad, LCD