MCIMX6L3DVN10AC

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Terminal Pitch :

0.5mm

Series :

i.MX6SL

Terminal Position :

BOTTOM

JESD-30 Code :

S-PBGA-B

Operating Temperature :

0°C~95°C TJ

RAM Controllers :

LPDDR2, LVDDR3, DDR3

Display & Interface Controllers :

Keypad, LCD

Surface Mount :

yes

USB :

USB 2.0 + PHY (3)

Graphics Acceleration :

yes

Supply Voltage-Max (Vsup) :

1.5V

Peak Reflow Temperature (Cel) :

260

HTS Code :

8542.31.00.01

Additional Interfaces :

AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART

Co-Processors/DSP :

Multimedia; NEON™ SIMD

RoHS Status :

ROHS3 Compliant

Core Processor :

ARM® Cortex®-A9

Speed :

1.0GHz

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Time@Peak Reflow Temperature-Max (s) :

40

Published :

2017

Ethernet :

10/100Mbps (1)

Packaging :

Tray

Voltage - I/O :

1.2V 1.8V 3.0V

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Height Seated (Max) :

1.1mm

Length :

13mm

Number of Cores/Bus Width :

1 Core 32-Bit

Factory Lead Time :

15 Weeks

Terminal Form :

Ball

Supply Voltage-Min (Vsup) :

1.375V

Security Features :

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Package / Case :

432-TFBGA