MCIMX6DP5EYM1AA

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Integrated Cache :

yes

Security Features :

ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS

Packaging :

Tray

Speed :

1.0GHz

RoHS Status :

ROHS3 Compliant

Co-Processors/DSP :

Multimedia; NEON™ SIMD

HTS Code :

8542.31.00.01

Operating Temperature :

-20°C~105°C TJ

Address Bus Width :

26

Terminal Position :

BOTTOM

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Supply Voltage-Min (Vsup) :

1.35V

Height Seated (Max) :

1.6mm

Graphics Acceleration :

yes

Surface Mount :

yes

Supply Voltage-Max (Vsup) :

1.5V

Factory Lead Time :

15 Weeks

Core Processor :

ARM® Cortex®-A9

Low Power Mode :

yes

Published :

2002

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Voltage - I/O :

1.8V 2.5V 2.8V 3.3V

SATA :

SATA 3Gbps (1)

USB :

USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)

Number of Terminations :

624

Additional Interfaces :

CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART

Terminal Pitch :

0.8mm

Number of Cores/Bus Width :

2 Core 32-Bit

External Data Bus Width :

64

Boundary Scan :

yes

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Length :

21mm

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

RAM Controllers :

LPDDR2, DDR3L, DDR3

Ethernet :

10/100/1000Mbps (1)

Format :

FIXED POINT

JESD-30 Code :

S-PBGA-B624

Display & Interface Controllers :

HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel

Terminal Form :

Ball

Series :

i.MX6DP

Package / Case :

624-LFBGA, FCBGA

ECCN Code :

5A992