MCIMX6DP4AVT1AB

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Terminal Pitch :

0.8mm

Surface Mount :

yes

Time@Peak Reflow Temperature-Max (s) :

40

Display & Interface Controllers :

HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel

Factory Lead Time :

15 Weeks

JESD-30 Code :

S-PBGA-B624

Supply Voltage-Min (Vsup) :

1.35V

Voltage - I/O :

1.8V 2.5V 2.8V 3.3V

Height Seated (Max) :

2.16mm

Length :

21mm

RoHS Status :

ROHS3 Compliant

SATA :

SATA 3Gbps (1)

Security Features :

ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS

Series :

i.MX6DP

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

USB :

USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

HTS Code :

8542.31.00.01

Operating Temperature :

-40°C~125°C TJ

Terminal Position :

BOTTOM

Peak Reflow Temperature (Cel) :

260

Terminal Form :

Ball

Supply Voltage-Max (Vsup) :

1.5V

Graphics Acceleration :

yes

Co-Processors/DSP :

Multimedia; NEON™ SIMD

Number of Terminations :

624

Speed :

1.0GHz

Core Processor :

ARM® Cortex®-A9

Published :

2002

Packaging :

Tray

Additional Interfaces :

CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART

Package / Case :

624-FBGA, FCBGA

Number of Cores/Bus Width :

2 Core 32-Bit

Ethernet :

10/100/1000Mbps (1)

RAM Controllers :

LPDDR2, DDR3L, DDR3