MCIMX6D6AVT10ADR

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

RoHS Status :

ROHS3 Compliant

Peak Reflow Temperature (Cel) :

260

Display & Interface Controllers :

Keypad, LCD

Series :

i.MX6D

Factory Lead Time :

15 Weeks

Terminal Position :

BOTTOM

Terminal Form :

Ball

Boundary Scan :

yes

Integrated Cache :

yes

Graphics Acceleration :

yes

Ethernet :

10/100/1000Mbps (1)

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Surface Mount :

yes

Package / Case :

624-FBGA, FCBGA

ECCN Code :

5A992

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

SATA :

SATA 3Gbps (1)

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Time@Peak Reflow Temperature-Max (s) :

40

JESD-30 Code :

S-PBGA-B624

Core Processor :

ARM® Cortex®-A9

Security Features :

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

HTS Code :

8542.31.00.01

Additional Interfaces :

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Format :

FIXED POINT

Speed :

1.0GHz

Number of Terminations :

624

Number of Cores/Bus Width :

2 Core 32-Bit

USB :

USB 2.0 + PHY (4)

Low Power Mode :

No

Bit Size :

32

Packaging :

Tape and Reel (TR)

RAM Controllers :

LPDDR2, LVDDR3, DDR3

Co-Processors/DSP :

Multimedia; NEON™ SIMD

Height Seated (Max) :

2.16mm

Voltage - I/O :

1.8V 2.5V 2.8V 3.3V

Terminal Pitch :

0.8mm

JESD-609 Code :

e1

Published :

2002

Operating Temperature :

-40°C~125°C TJ

Length :

21mm